Sr. Staff Engineer Technology Development DSO at Infineon Technologies

Wuxi City, Jiangsu, China -

Full Time

Start Date

Immediate

Expiry Date

04 Sep, 26

Salary

0.0

Posted On

06 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Design, Process Development, Package Layout Evaluation, Process Feasibility Verification, DOE Planning, Experimental Data Analysis, CAD Layout Design, Semiconductor Assembly, Packaging Flow, Design Review, Technical Reporting, Cross-functional Collaboration

Industry

Semiconductor Manufacturing

Description

Be responsible for new package design & process development, package layout evaluation and process feasibility verification Your Role Key responsibilities in your new role 1.Be responsible for new package design & process development, package layout evaluation and process feasibility verification 2.Support full product lifecycle from R&D, pilot run to mass production ramp-up, troubleshoot packaging process defects and technical abnormalities 3.Collaborate with local & overseas R&D, Operation teams; compile technical reports and evaluation documents 4.Optimize existing packaging solutions to balance product performance and manufacturing cost 5.Research advanced packaging technologies, conduct verification for new processes and new materials introduction Your Profile Qualifications and skills to help you succeed 1.Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline 2.At least 10 years of working experience in semiconductor assembly and packaging development 3.Prior experience in DSC, Map mold, SON, TO, DSO power product development is strongly preferred 4.Knowledge in semiconductor BE assembly / test industry 5.Proficient in packaging flow, design review, DOE planning and experimental data analysis; skilled in CAD layout design and common office & data analysis tools 6.A structured and analytical mindset with a proven ability to drive complex topics independently from analysis to implementation 7.Good aptitude for communication, collaboration, negotiation and solution finding 8.Competent in daily oral & written English for cross-functional and overseas communication Contact: minfang.zhou@infineon.cn, LinkedIn #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.

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Responsibilities

Responsible for new package design, process development, and feasibility verification for semiconductor products. Supports the full product lifecycle from R&D to mass production while optimizing packaging solutions for performance and cost.