Start Date
Immediate
Expiry Date
22 Jun, 26
Salary
0.0
Posted On
24 Mar, 26
Experience
10 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Package Design, Power Modules, 3D CAD Tools, Solidworks, FEA Tools, ANSYS, SimScale, Mechanical Warpage Modeling, Stress Modeling, Thermal Modeling, Test Plan Development, Mechanical Tests, Materials Science, Semiconductor Packaging, Troubleshooting, Manufacturing Assistance
Industry
Semiconductor Manufacturing