Sr. Staff Package Design Engineer - Power Modules at Renesas Electronics

Zhubei City, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

22 Jun, 26

Salary

0.0

Posted On

24 Mar, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Design, Power Modules, 3D CAD, FEA, Solidworks, ANSYS, SimScale, Mechanical Warpage, Stress Modeling, Thermal Modeling, Test Plan Development, Materials Science, Semiconductor Packaging, Troubleshooting, Manufacturing Assistance, System Analysis

Industry

Semiconductor Manufacturing

Description

Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world. Job Description Renesas is seeking a package expert for its AI High Density Power Modules product families. These products push the technology limits of speed, density, and efficiency and deliver power to the highest performance computing and connectivity functions. Typical applications include Artificial Intelligence, High Performance Networking, and other High Performance Computing applications. This role sits within our Performance Computing Power business, which is one of the fastest-growing and exciting product lines at Renesas, with a multi-market scope and a large product development team. Work closely with cross-functional teams to provide the package design of a power module and produce 3D drawings Help develop and correlate mechanical warpage, stress, and thermal modeling of the components in power modules Generate detailed documentation of simulation results for internal and external stakeholders Develop test plans, test documentation and support mechanical tests. Assist in the validation of models through comparison with experimental data and field measurements Work with our internal and external manufacturing partners to prototype designs and bring them to manufacturing. Knowledge of materials science and manufacturing processes specific to semiconductor packaging. Provide hands-on, troubleshooting, process, and manufacturing assistance in support of a rapid development cycle Qualifications MSEE /BSEE with 10+ years of experience in the mechanical design and development of high-volume electronics products. Proficiency with 3D CAD tools (Solidworks) and FEA tools (ANSYS preferred, SimScale) Ability to perform system analysis/calculations including: stress, fatigue, reliability, life expectancy, tolerance studies Experience in power modules and thermal analysis is a plus Experience in PCBA process is preferred Solid analytical and problem-solving skills with attention to detail Excellent communication and teamwork skills Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, disabilities, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning. Employment Type: Regular (PERM) Remote Work Available: No

Responsibilities

The engineer will provide package design for power modules, including generating 3D drawings, and will develop and correlate mechanical warpage, stress, and thermal modeling of components. They will also develop test plans, support mechanical tests, and work with manufacturing partners to bring designs into production.