Sr Staff Package Design Engineer at Renesas Electronics

Tempe, Arizona, United States -

Full Time

Start Date

Immediate

Expiry Date

15 Sep, 26

Salary

0.0

Posted On

17 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Design, Hermetic Packaging, Ceramic Packaging, Radiation-Tolerant Packaging, Class P Plastic Packaging, AutoCAD, DOE Activities, Package Qualification, Semiconductor Assembly, MIL-STD-883, MIL-PRF-38535, MIL-STD-750, Cross-functional Collaboration, Materials Selection, Process Optimization, Technical Roadmap Development

Industry

Semiconductor Manufacturing

Description

Company Description Renesas is a global semiconductor company delivering embedded solutions across microcontrollers, analog, power, and SoC products. Our technologies support critical applications across automotive, industrial, infrastructure, and IoT markets, helping enable smarter, safer, and more efficient systems. Job Description Renesas is seeking a Sr. Staff Package Design Engineer to support advanced package technology development for commercial space, aerospace, and high-reliability power applications. This role will focus on hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging solutions, working closely with product design, reliability, OSAT partners, in-house assembly teams, and key package suppliers to define, develop, qualify, and optimize package technologies for demanding high-reliability environments. Responsibilities Develop hermetic, ceramic, metal, radiation-tolerant, and Class P plastic package technologies and interconnect methods for commercial space, aerospace, and high-reliability power applications. Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms. Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and Renesas’ in-house Palm Bay assembly site. Partner with Renesas product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD. Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications. Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required project schedules. Maintain technical expertise on advances in hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging technologies. Participate in packaging roadmap development, with a focus on execution, manufacturability, reliability, and long-term package strategy. Qualifications 5–12 years of relevant experience in semiconductor package development, with emphasis on hermetic, ceramic, metal, radiation-tolerant, or Class P plastic packaging. Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification. Familiarity with high-reliability, aerospace, commercial space, or defense-related semiconductor packaging requirements. Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites. Knowledge of AutoCAD and Microsoft Office tools, including Excel, PowerPoint, and Word. Strong communication, analytical, presentation, and cross-functional collaboration skills. Familiarity with MIL-STD-883, MIL-PRF-38535, and MIL-STD-750 standards. Education Bachelor’s, Master’s, or Doctorate degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related technical field. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Shape Your Future with Us. Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas. Employment Type: Regular (PERM) Remote Work Available: No

Responsibilities

Develop and optimize advanced hermetic, ceramic, and radiation-tolerant package technologies for aerospace and high-reliability power applications. Collaborate with OSAT partners and internal teams to define process flows, create detailed drawings in AutoCAD, and qualify new package platforms.