Sr. Staff Project/Program Design at Renesas Electronics

George Town, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

21 Sep, 26

Salary

0.0

Posted On

23 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Program Management, Project Management, Semiconductor Packaging, NPI Execution, COGS Reduction, Capacity Expansion, Stakeholder Management, Cross-functional Leadership, Risk Mitigation, Supply Chain Management, OSAT Interface, Product Lifecycle Management, Analytical Problem Solving, Microsoft Office, Electrical Engineering, Quality Standards

Industry

Semiconductor Manufacturing

Description

Job Description Job Description Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects. Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios. Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability. Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans. Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities. Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program. Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines. Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies. Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs. Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation. Qualifications Bachelor’s or Master’s degree in Electrical Engineering, with 8+ years of experience in semiconductor packaging technology and product lifecycle management. Strong understanding of semiconductor packaging manufacturing flows – including development and production processes, package architectures, and various package types with prior work experience at an assembly site as a process or integration engineer considered a strong plus. Proven ability to lead complex, cross‑functional programs in ambiguous environments, supported by foundational Program/Project Management knowledge (coursework, certification, or equivalent). Strong stakeholder management, communication, collaboration, and cross‑functional partnership skills across engineering, operations, supply chain, and OSAT teams. Highly analytical with strong organizational, problem‑solving, time‑management, and multitasking capabilities. Quick learner with the ability to adopt new tools, systems, and processes efficiently; proficient in Microsoft Office and project management tools. Self‑motivated, inquisitive, and committed to continuous personal and professional development. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Employment Type: Regular (PERM) Remote Work Available: No

Responsibilities

Lead cross-functional teams to execute NPI projects, COGS reduction programs, and capacity expansion initiatives within semiconductor manufacturing. Manage detailed schedules, coordinate project gate reviews, and act as a liaison between product groups and supply chain teams.