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Staff Engineer, Advanced Development Process and Equipment, Dry Etch at Micron Technology

Hiroshima, , Japan -

Full Time

Start Date

Immediate

Expiry Date

28 Jan, 26

Salary

0.0

Posted On

30 Oct, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Problem-Solving, Process Optimization, Yield Improvement, SPC, FDC, RMS, APC, Collaboration, Communication, Engineering, Dry Etch, Material Evaluation, Cost Reduction, Audit Management, Quality Management

Industry

Semiconductor Manufacturing

Description

Identify, diagnose and resolve assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site to site portability Manage / audit material suppliers to achieve quality, cost and risk management objectives Support internal and external audits Proven experience in engineering, particularly in the dry etch process with Masters/PhD Degree or Bachelors degree in Engineering fields with 5 years experience in semiconductor industry are preferred. Strong problem-solving skills and the ability to identify detailed solutions. Experience in process optimization and yield improvement initiatives. Familiarity with SPC, FDC, RMS, and APC systems. Ability to collaborate effectively with cross-functional teams. Excellent communication abilities and the skill to effectively guide projects to successful completion.

Responsibilities

Identify, diagnose, and resolve assembly process-related problems while coordinating and executing process, equipment, and material evaluation initiatives. Lead continuous yield improvement and cost reduction activities, and support site-to-site portability.