Start Date
Immediate
Expiry Date
20 May, 26
Salary
0.0
Posted On
19 Feb, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Process Engineering, Semiconductor Assembly, Packaging Equipment, Flip Chip, Die Attach, Thermocompression Bonding, Data Analysis, Matlab, JMP, Minitab, Mechanical Engineering, Electrical Engineering, Mechatronics Engineering
Industry
Semiconductor Manufacturing