Staff Engineer Failure Analysis at Infineon Technologies AG Australia

Kulim, Kedah, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

05 Mar, 26

Salary

0.0

Posted On

05 Dec, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Electrical Failure Verification, Fault Isolation, Physical Root Cause Analysis, FA Reporting, Cross Functional Collaboration, FA Equipment Ownership, Application Board Setup, Test Methodology, CAD Navigation, Imaging for Defect Visualization, Sample Preparation, Repackaging Skills, Semiconductor Processing, Device Knowledge, Testing Knowledge

Industry

Semiconductor Manufacturing

Description

Your Role Key responsibilities in your new role 1) Perform IC (complex functional) Failure Analysis [FA] on wafer and package level starting from electrical verification, fault isolation and physical root cause analysis. 2) Prepare FA reports that can lead to root cause finding and corrective action to cross functional team. Participate, lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings. 3) FA equipment / tool ownership. 4) Interface with designers, test, product, process integration and unit process engineers, problem solving team, CQM (customer quality management) team to understand the analysis requirement. 5) Responsible for achieving EFA KPIs. 6) Setup of application board, product specific test methodology and localization capability. 7) CAD navigation, layout and schematic analysis to identify the failure location and hypothesis. 8) Responsible for Fault Tree Analysis (FTA) in case of no physical defect found. Your Profile Qualifications and skills to help you succeed Qualification: Degree / Master / PhD in Electrical and Electronic Engineering Technical Skills: 1) Advanced electrical failure verification and localization, i.e. bench testing for IV curve & functional verification, die front/back-side localization, electrical micro-probing with passive & active probe, OBIRCH/TIVA/SEI localizations. 2) Advanced sample preparation, i.e. wet/dry chemical, backside preparation, package preparation. 3) Imaging for defect visualization, i.e. optical, SEM and FIB (incl. Voltage Contrast). 4) Repackaging skill i.e. Chip On Board (COB). 5) Basic CAD Navigation System. 6) Semiconductor processing, fabrication, device and testing knowledges. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

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Responsibilities

The Staff Engineer in Failure Analysis will perform complex functional failure analysis on both wafer and package levels, leading to root cause identification and corrective actions. They will also prepare reports and participate in cross-functional meetings to present findings.