Start Date
Immediate
Expiry Date
04 Jun, 26
Salary
253000.0
Posted On
06 Mar, 26
Experience
10 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Numerical Modeling, Simulation, Mechanical Design, Thermal Design, Micro-electronic Components Modeling, Interconnects Modeling, Solder Joints Modeling, BGA Modeling, Advanced-Packaging Architectures Modeling, Process Automation Scripting, Python, MATLAB, ANSYS APDL, Thermal Analysis, Static Simulations, Dynamic Simulations
Industry
Semiconductor Manufacturing
How To Apply:
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