Staff Engineer, Packaging Engineering (FIB) at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

12 Oct, 26

Salary

0.0

Posted On

14 Jul, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

SEM, FIB, Physical Failure Analysis, Semiconductor Packaging, Root-Cause Analysis, Cross-sectioning, Delayering, Defect Localization, Device Reliability, NAND Technology, ASIC Technology, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, Cross-functional Collaboration

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description We are seeking an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. This role is part of the Chip Package Integration (CPI) Failure Analysis function and plays a key role in improving device reliability and influencing package and product design. The position interfaces closely with wafer fabrication (NAND and ASIC), package and product design teams, electrical and physical characterization, assembly R&D, and other process engineering groups. ESSENTIAL DUTIES AND RESPONSIBILITIES: Develop and maintain package recipe and process baselines based on FA findings. Collaborate with fab process, package design, assembly R&D, and characterization teams. Evaluate package reliability and robustness in response to fab process changes. Lead package evaluation and qualification for NAND and ASIC technologies. Support chip structure optimization through detailed FA results and recommendations. Perform device-level physical failure analysis (PFA) using SEM and FIB techniques (mandatory). Conduct FIB cross-sectioning, delayering, and defect localization for root-cause analysis. Utilize SEM imaging to analyze device structures, interfaces, and failure mechanisms. Identify and resolve structural and packaging-related reliability issues. Provide FA insights to influence package and product design decisions. Qualifications REQUIRED: Bachelor’s degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related disciplines. Strong understanding of device structures, packaging architectures, and failure mechanisms. More than 3 years hands-on SEM and FIB experience (MUST). Solid experience in physical failure analysis (PFA) of semiconductor devices. Good English communication skills, both written and spoken. Ability to work effectively in cross-functional, global teams. PREFERRED: Background in wafer fab processes and device design. Experience with NAND and/or ASIC technologies. Familiarity with electrical and physical characterization methods. Knowledge of assembly processes and advanced semiconductor packaging. Experience supporting fab or package process change qualification. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

Perform device-level physical failure analysis using SEM and FIB techniques to identify root causes of semiconductor chip and package failures. Collaborate with cross-functional teams to optimize chip structures and influence package and product design decisions.