Staff Engineer, Packaging Engineering at Sandisk

Bengaluru, karnataka, India -

Full Time

Start Date

Immediate

Expiry Date

21 Aug, 26

Salary

0.0

Posted On

23 May, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermal Management, CFD, FEA, Thermal Testing, Analytical Problem Solving, Quantitative Problem Solving, Communication, Teamwork, Package Engineering, Semiconductor Packaging

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Bangalore site. In this role, you will be pivotal in driving innovation in thermal design for our high-performance flash products, as well as developing and maintaining advanced simulation tools. ESSENTIAL DUTIES AND RESPONSIBILITIES: Work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. Innovate thermal management solutions for high-performance flash products Enhance and maintain our modeling and simulation infrastructure to improve efficiency and accuracy across the design and manufacturing processes. This position may interface with package & product design, electrical, thermal and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams. Qualifications REQUIRED: Ph.D. in Mechanical Engineering, or M.S. in Mechanical Engineering plus >2 years of relevant industrial experience. Solid knowledge through academic coursework or research experience required in thermal engineering. Working knowledge in designing and conducting thermal testing and/or using a commercial CFD/FEA package. SKILLS: Strong analytical and quantitative problem-solving ability Good communication, relationship skills and a team player PREFERRED: Knowledge in thermal, structural or mechanical in package engineering Interested in semiconductor industry. Additional Information Sandisk is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the Equal Employment Opportunity is the Law poster. Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. Business Function: Packaging Engineering Work Location: Bangalore PTP Office (IBP)--LOC_WDT_IBP

Responsibilities

Drive innovation in thermal design for high-performance flash products across semiconductor packaging, PCBA, and host levels. Develop and maintain advanced modeling and simulation infrastructure to improve design and manufacturing efficiency.