Start Date
Immediate
Expiry Date
25 Mar, 26
Salary
0.0
Posted On
25 Dec, 25
Experience
2 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Process Development, Die Bond, Flip Chip, Analytical Skills, Problem Solving, Collaboration, Negotiation, Statistical Data Analysis, Design Of Experiment, Communication, Presentation Skills, Microsoft Office
Industry
Semiconductor Manufacturing
How To Apply:
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