Staff Package Design and Develop Engineer- Power module at Renesas Electronics

Zhubei City, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

10 Jun, 26

Salary

0.0

Posted On

12 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Power Module Design, Package Development, Embedded Die Laminate Technology, SMT, AutoCAD, OSAT Management, DOE, Process Optimization, Package Qualification, Roadmap Development, Wire-bonding, Flip Chip, SPC, Statistical Analysis, Interpersonal Skills, Communication Skills

Industry

Semiconductor Manufacturing

Description

Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world Job Description Design and develop Power Modules which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI. Define package technologies tooling & qualification for Commercial Industrial power device packaging for servers and AI power applications. Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test). Work with Renesas product designers to develop detailed Power Module package drawings for plastic packages using AutoCAD. Work with OSAT(Outsourced Semiconductor Assembly & Test ) to run DOE to optimize processes and establish process spec. Work with Product groups and Reliability team, qualify new packages and processes within required schedule from Product Engineer/Program manager. Develop and maintain technical expertise on advances and innovations Power Module plastic packages. Participate in packaging roadmap development & focus on execution. Qualifications • Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. • 5-12 years of relevant experience in package development emphasizing Power Module package design and assembly process development • Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis. • Strong interpersonal and communication skills. • Strong analytical and presentation skills. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, disabilities, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning. Employment Type: Regular (PERM) Remote Work Available: No

Responsibilities

The role involves designing and developing Power Modules utilizing embedded die laminate technology with SMT for commercial industrial power device packaging, specifically for servers and AI applications. Responsibilities include defining package technologies, selecting materials and subcontractors, developing package drawings, running DOE for process optimization, and qualifying new packages.