Start Date
Immediate
Expiry Date
05 Oct, 26
Salary
0.0
Posted On
07 Jul, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Package Design, Process Engineering, PQFN Packaging, Thin Die Assembly, SPS Solder Attach, SPC, Statistical Analysis, JMP Software, Product Lifecycle Management, Change Management, Quality Assurance, Reliability Testing
Industry
Semiconductor Manufacturing