Staff/Principal Engineer - Process Development, CMP at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

24 Feb, 26

Salary

0.0

Posted On

26 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Development, CMP, 3D NAND, Experiment Management, Vendor Collaboration, Process Monitoring, Technical Expertise, Communication Skills, Project Management, Data Science, Modeling, AI Optimization, Chemical Mechanical Planarization, Materials Science, Chemical Engineering, Electrical Engineering

Industry

Semiconductor Manufacturing

Description

Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts. Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications. Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions. Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes. Incorporate best known manufacturing methods into early development phase of upcoming nodes. Design and implement advanced process monitoring and control methodologies. Provide strategic roadmap for N+, N++ and future NAND Nodes. Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. This position requires communication and collaboration with associates both within the region and internationally. Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions. As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings. At least 5 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. Strong collaboration and communication skills (verbal and written). Self-driven, adaptable, and able to manage multiple projects. Proven ability to take calculated risks and execute novel solutions. Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure. An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory. Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

Responsibilities

The role focuses on improving process margins for 3D NAND parts and involves advanced CMP process development. It requires collaboration with vendors and the design of advanced process monitoring methodologies.