Staff Process Engineer at Qorvo

Hillsboro, Oregon, United States -

Full Time

Start Date

Immediate

Expiry Date

19 Jun, 26

Salary

0.0

Posted On

21 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Plasma Etch, Process Ownership, RF GaAs, Integrated Circuits, Technology Transitions, Process Integration, Quality Assurance, Yield Management, Reliability, Data Analysis, Statistical Process Control, Structured Problem-Solving, Root-Cause Investigations, RIE, ICP Etch Platforms, JMP

Industry

Semiconductor Manufacturing

Description

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet. The candidate will be a key member of the plasma etch team tasked with driving technical solutions and enabling next‑generation plasma etch platforms for RF GaAs based integrated circuits. Responsibilities include process ownership of plasma etch modules, leading technology transitions to newer etch platforms, and ensuring robust integration with upstream and downstream process modules. The role requires close collaboration with cross‑functional groups to ensure manufacturable processes that meet quality, yield, and reliability requirements. The ideal candidate will have greater than 5 years of process ownership experience with a strong, hands‑on understanding of plasma etch fundamentals, including plasma chemistry, etch selectivity, profile and CD control, and defect mechanisms. Demonstrated strength in data analysis, statistical process control, and structured problem‑solving is required, along with the ability to drive root‑cause investigations and implement sustainable process improvements. QUALIFICATIONS: Education: PhD, Masters, or Bachelors in one of the following areas: Chemistry, Chemical Engineering, Materials Science, Physics, Optics, Electronic or Electrical Engineering. Experience: PhD candidates: 3+ years of plasma etch experience. MS candidates: 6+ years of plasma etch experience. BS candidates: 8+ years of plasma etch experience. Technical Skills: Strong knowledge and past tool ownership experience with RIE and ICP etch platforms. Exceptional technical and troubleshooting skills. Analytical & Statistical Skills: Ability to think logically, construct meaningful experiments, analyze data, and use a structured problem-solving approach, proven application of SPC and DOE. Experience with data analysis tools and techniques such as JMP or Spotfire or similar SW packages. Communication: Excellent verbal and written communication skills, with the ability to communicate effectively at all levels of the organization. Teamwork: Ability to work collaboratively with a hands-on approach and a customer-oriented mindset. Adaptability: Capable of working in a highly dynamic environment with tolerance for ambiguity. Ability to follow instructions as well as being able to work on self-directed assignments and advise senior management. Attention to Detail: Keen eye for detail and precision. This position is not eligible for visa sponsorship by the Company. MAKE A DIFFERENCE AT QORVO We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us. We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.

Responsibilities

The candidate will be a key member of the plasma etch team, responsible for process ownership of plasma etch modules and driving technical solutions for next-generation platforms for RF GaAs based integrated circuits. This includes leading technology transitions and ensuring robust integration with upstream and downstream process modules.