Start Date
Immediate
Expiry Date
22 Jul, 26
Salary
0.0
Posted On
23 Apr, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Process engineering, Package development, Thin wafer handling, Solder attach processes, PQFN, QFN, WLCSP, SPC, Statistical analysis, JMP, Project management, Change management, Product lifecycle management, Communication skills, Analytical skills
Industry
Semiconductor Manufacturing