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Structural/ Thermal Modeling Engineer 3 at Lam Research

Tualatin, Oregon, United States -

Full Time

Start Date

Immediate

Expiry Date

13 Jan, 26

Salary

0.0

Posted On

15 Oct, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermo-Elastic Modeling, Structural Modeling, CFD Applications, ABAQUS, ANSYS, NASTRAN, COMSOL, Multi-Physics Models, AI/ML Concepts, Coding, Design Reviews, Communication, Continuous Improvement, Solid Mechanics, Heat Transfer, Fluid Mechanics, Semiconductor Metrology

Industry

Semiconductor Manufacturing

Description

Developing physics-based models for Thermo-Elastic, Structural and CFD applications for components in semiconductor capital equipment industry. Experience in commercial software like ABAQUS, ANSYS, NASTRAN, COMSOL, etc., is highly desirable. Developing methods for translating tool operational data into improved engineering designs Developing and maintaining live multi-physics models Provide written reports and oral presentation of results to design teams and management. Work directly with mechanical, electrical, process and software engineers to define design requirements, goals and objectives of design, CIP, testing and simulation plans. PhD in Mechanical Engineering or closely related field with strong emphasis in solid mechanics, heat transfer and fluid mechanics or related fields. Strong ability and understanding of AI/ML concepts and hybrid physics-based AI/ML modeling software. Coding ability to supplement commercial software for specific applications as needs arise. Ability to work within a team to own and design concepts and drive design decisions. Ability to lead and conduct design reviews in cross functional and matrixed environments. Strong written and oral communication. Self-starter to start own initiatives and projects for continuous improvement in capabilities and design. This is a graduate eligible role. Preferred knowledge of chemistry, semiconductor metrology methods, and employing sensors and hardware designs in a vacuum environment is also a plus.

Responsibilities

Develop physics-based models for Thermo-Elastic, Structural, and CFD applications in the semiconductor capital equipment industry. Collaborate with cross-functional teams to define design requirements and present results to management.