Structural/ Thermal Modeling Engineer 3 at Lam Research

Tualatin, Oregon, United States -

Full Time

Start Date

Immediate

Expiry Date

05 Apr, 26

Salary

0.0

Posted On

05 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermo-Elastic Modeling, Structural Modeling, CFD Applications, AI/ML Methods, Data-Driven Modeling, Optimization, Statistical Methods, Multi-Physics Modeling, Multi-Scale Modeling, Uncertainty Quantification, Fracture Mechanics, Fatigue Analysis, Numerical Methods, Thin Film Mechanics, Ceramic Materials, Big Data

Industry

Semiconductor Manufacturing

Description

The group you’ll be a part of In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry. The impact you’ll make We move atoms that move the world. At Lam Research, we create equipment that allows chipmakers to build device features more than 1,000 times smaller than a grain of sand. This tiny scale has a huge impact. Virtually every leading-edge chip inside the electronic products you use every day (TVs, smartphones, laptops, cars—even medical devices) has been made using our equipment. As one of the world’s most trusted suppliers in the semiconductor equipment industry, we’re transforming technology. Our equipment places atoms so precisely that nearly every chip today is made using our innovations. To build a prosperous career, start with an atom. Should you choose to walk the path historically driven by Moore’s law, your primary job function will involve cutting edge R&D activities in the Semiconductor Equipment Industry. If solving challenges no one has faced before or attempted are of interest to you, then Lam Research is the company for you. What you’ll do Developing physics-based models for Thermo-Elastic, Structural and CFD applications for components in semiconductor capital equipment industry. Experience in commercial software like ABAQUS, ANSYS, NASTRAN, COMSOL, etc., is highly desirable. Data driven modeling - Juncture of physics-based modeling with data-driven, AI/ML methods: Developing methods for translating tool operational data into improved engineering designs Utilizing DOE, Optimization, and statistical methods to correlate Simulation data to experimental data. Stochastic optimization tools to bridge between simulation and experiments. Predict, measure and analyze the experimental data of mechanical designs, process specification and software programs for semiconductor manufacturing equipment. Uncertainty Quantification & propagation, sensitivity analysis, statistical inference for model calibration, decision making under uncertainty. Developing and maintaining live multi-physics models Multi-scale modeling from nano, meso to macro levels Provide design improvements of in-service tools based upon quantitative field measured failure data and less quantitative quality metrics as measured by Lam Research. Use advanced statistical, probabilistic and forecasting methods to best quantify design and performance of overall system. Provide written reports and oral presentation of results to design teams and management. Work directly with mechanical, electrical, process and software engineers to define design requirements, goals and objectives of design, CIP, testing and simulation plans. Who we’re looking for Minimum Qualifications: PhD in Mechanical Engineering or closely related field with strong emphasis in solid mechanics, heat transfer and fluid mechanics or related fields. Strong ability and understanding of AI/ML concepts and hybrid physics-based AI/ML modeling software. Coding ability to supplement commercial software for specific applications as needs arise. Ability to work within a team to own and design concepts and drive design decisions. Ability to lead and conduct design reviews in cross functional and matrixed environments. Strong written and oral communication. Self-starter to start own initiatives and projects for continuous improvement in capabilities and design. This is a graduate eligible role. Preferred qualifications Preferred knowledge of chemistry, semiconductor metrology methods, and employing sensors and hardware designs in a vacuum environment is also a plus. Expertise or working knowledge in several of these areas are desired: Big data, AI/ML algorithms and concepts. Multi-physics modeling, Multi-scale modeling, Feature scale from nano, meso scale to macro scale. Heat transfer in low pressure regimes HPC, optimization and cloud computing Numerical methods – Smoothed Particle Hydrodynamics (SPH), MD, BTE, Spectral Element, molecular dynamics, DSMC. Thin film mechanics and characterization Ceramic materials Fracture mechanics and Fatigue Uncertainty qualification, error analysis, statistical methods. Statistical theory, DOE, optimization algorithms. Our commitment We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results. Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees. Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time. Our Perks and Benefits At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.

Responsibilities

Develop physics-based models for Thermo-Elastic, Structural, and CFD applications in semiconductor capital equipment. Collaborate with cross-functional teams to define design requirements and improve engineering designs based on operational data.