Substrate Engineer at Broadcom UK Ltd

Singapore, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

05 Jul, 26

Salary

0.0

Posted On

06 Apr, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

IC Substrate Manufacturing, Packaging Technology, NPI Activity, Process Improvement, Yield Management, Failure Analysis, Problem Solving, Risk Assessment, Production Engineering, ABF Substrate, Flipchip, Ball Grid Arrays, Laminate Substrates, Quality Control, Technical Specifications, Cross-functional Leadership

Industry

Semiconductor Manufacturing

Description

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: JD: Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices. Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing. Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time. Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements Drive capability enhancement and cost reduction projects JR: Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemicalor Electrical). 8 years' experience in IC substrate manufacturing technologies and processes. Direct process and operational experience in a substrate manufacturing operations line is required. Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required. Track record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing. Direct process and operational experience in manufacturing environment Experience in component quality interactions with SMT processibility is not a pre-requisite, but will be favorable Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers. Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues. Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward. Thorough knowledge of problem solving methodologies and failure analysis techniques. Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations. Demonstrate good communication skills in problem resolution. Have a very good command on spoken and written English, Fluent in Mandarin Willing to travel throughout Asia to support manufacturing locations. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.

How To Apply:

Incase you would like to apply to this job directly from the source, please click here

Responsibilities

Manage and resolve issues related to packaging, manufacturing, yield, and quality with IC substrate subcontractors. Drive new product pre-production engineering activities, process improvements, and capability enhancement projects.