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System Design Engineer at Apple

San Diego, California, United States -

Full Time

Start Date

Immediate

Expiry Date

20 Jul, 26

Salary

0.0

Posted On

21 Apr, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Multi-layer board design, Electrical design, Physical design, Circuit design, Schematic capture, System integration, Power integrity, Signal integrity, Power delivery networks, High-speed signals, Cadence APD, Cadence Allegro, HDI PCB, Flip-chip BGA, Design verification

Industry

Computers and Electronics Manufacturing

Description

Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. In this role, you will own and drive the electrical and physical design of multi-layer boards for prototype systems, developing reference designs that meet stringent area, cost, and performance requirements for product development. DESCRIPTION Work with cross-functional team to understand system requirements, from both physical design limitations and performance requirements Develop physical design implementations meeting stringent power and signal integrity requirement Drive co-optimization of physical design on MLB and package Provide implementation guidelines and feedback to silicon, package, and system design groups Perform feasibility study, design verification, and sign-off. MINIMUM QUALIFICATIONS Bachelor’s degree. PREFERRED QUALIFICATIONS 4+ years experience in physical design of multi-layer boards (MLBs). Experience in circuit design, schematic capture, and system integration. Strong physical understanding of power and signal integrity fundamentals. Experience in the physical design of Power Delivery Networks (PDNs) and high-speed signals at PCB level. Familiar with Cadence APD/Allegro for physical design. Familiar with High Density Interconnect (HDI) PCB and Flip-Chip (FC) BGA package substrate technologies. Ability to work and communicate effectively in a multi-functional team.

Responsibilities

You will own and drive the electrical and physical design of multi-layer boards for prototype systems. This involves collaborating with cross-functional teams to meet stringent power, signal integrity, and performance requirements.