Systems Engineer Lead III at FOXCONN ASSEMBLY LLC

Santa Clara, California, United States -

Full Time

Start Date

Immediate

Expiry Date

06 Jul, 26

Salary

200000.0

Posted On

07 Apr, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

System architecture, Prototype development, GPU architecture, ARM CPU architecture, NVIDIA NVLink, Blackwell platforms, PCB layout, Power delivery networks, Liquid cooling technologies, EDA tools, Cadence, Altium, High-speed digital design, Signal integrity, Electromagnetic interference mitigation, R&D leadership

Industry

Manufacturing

Description

Job Title: Systems Engineer Lead III FSLA Status: (Exempt or Non-exempt): Exempt Location (City, State): Santa Clara, CA Reports To: Senior Director, RD Direct Reports (Yes, No): No Company Overview: Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 200 campuses across 24 countries. In the US, Foxconn employs 6,500 across 40 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2023, Foxconn ranks 32nd among the Fortune Global 500 and reported revenue of approximately USD $213 billion in 2024. The company’s diverse product offerings span four major segments: smart consumer electronics, cloud, and networking solutions, computing, and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together these initiatives position the company as a leader for innovation in the 21st century. Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods. Job Summary: The Systems Engineer Lead III drives system architecture, prototype development, and cross-functional design execution, while overseeing R&D planning, cost optimization, risk mitigation, and technical innovation across U.S. and Taiwan teams. Duties and Responsibilities: * Define system specifications and develop high-level hardware architectures based on market trends and customer requirements. * Lead prototype development and drive root cause analysis to resolve complex design defects. * Collaborate with cross-functional teams, including Hardware, Firmware, Software, Mechanical, Thermal, Manufacturing, and QA to ensure robust, stable, and manufacturable designs. * Own the R&D roadmap, drive Bill of Materials cost optimization, and implement risk mitigation strategies to achieve timely mass production. * Drive technology innovation, including patent development, maintain technical documentation, and mentor junior engineers across U.S. and Taiwan teams. * BOM & Component Engineering: Manage BOMs and evaluate alternate components for supply chain optimization. Education: * Master’s degree in Engineering, Electronics, Mechanical Engineering, or related fields. Experience: * Over 5 years of experience. * Deep expertise in GPU and ARM CPU architectures, including NVIDIA NVLink and Blackwell platforms. * Strong expertise in PCB layout, power delivery networks, and advanced liquid cooling technologies. * Expert in EDA tools (Cadence, Altium) for high-speed digital design and signal integrity. * Extensive experience in high-frequency signal integrity and electromagnetic interference mitigation. * Exceptional problem-solving skills and proven ability to collaborate across cross-functional teams. * 2–10+ years of experience in server or embedded systems, with a proven track record in R&D leadership preferred. * Professional fluency in English; with the ability to lead technical discussions with U.S. vendors and manufacturing teams. * Bilingual language skills in Chinese and English is a plus but not required. Physical Demands & Working Conditions: * Ability to sit or stand for extended periods during scheduled shifts. * Ability to occasionally walk, bend, or reach while supporting office and facility operations. * Ability to perform repetitive hand movements when handling office supplies, documents, or computer equipment. * Work performed primarily in an office or facility environment with regular interaction with employees and visitors. EEOC Statement Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.

How To Apply:

Incase you would like to apply to this job directly from the source, please click here

Responsibilities

The Systems Engineer Lead III is responsible for defining system architecture, leading prototype development, and overseeing cross-functional design execution. They also manage R&D planning, cost optimization, risk mitigation, and technical documentation across international teams.