Technical Director – Advanced Packaging at Applied Materials

Hsinchu, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

19 Feb, 26

Salary

0.0

Posted On

21 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging, Technical Leadership, Customer Engagement, Process Optimization, Yield Improvement, Productivity Enhancement, Cost Efficiency, Technical Project Management, Team Management, Data-Driven Reporting, Analytical Methodologies, Cross-Functional Collaboration, Mentoring, Strategic Planning, Integration Solutions, Communication Skills

Industry

Semiconductor Manufacturing

Description

Lead the development, optimization, and deployment of advanced packaging technologies. Act as the primary technical liaison to TSMC's Advanced Packaging team, supporting both tactical and strategic initiatives. Drive customer engagement through demos, early learning systems, evaluations, and first-in-fab projects. Run reqular technical review meeting (TRM), be the technical voice of customer (VoC) , positively influencing product developing roadmap at early design phases . Collaborate with senior customer stakeholders to align roadmap , solve integration ,complex process challenges, improving yield, productivity, and cost efficiency . Deliver clear, data-driven technical reports and recommendations to internal teams and external partners. Build and mentor a high-performing technical team, fostering innovation and cross-functional collaboration. Contribute to long-term technology roadmaps and strategic planning for advanced packaging solutions. Introduce and implement new analytical methodologies to improve process control and standardization. Promote knowledge sharing and best practices across business units and product lines. Master's or Ph.D. degree in Materials Science, Chemical Engineering, or Electrical Engineering. 15+ years of experience in the semiconductor industry, with a strong focus on advanced packaging R&D. Proven track record in new product introduction (NPI) and cross-functional technical program leadership Demonstrated success in technical project management and customer engagement, particularly in development-stage technologies. Strong leadership and team management capabilities, with the ability to mentor and grow high-performing technical teams. Excellent communication skills in English; Mandarin proficiency is required. Willingness to travel domestically and internationally as needed.

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Responsibilities

Lead the development and deployment of advanced packaging technologies while acting as the primary technical liaison to TSMC's Advanced Packaging team. Collaborate with senior customer stakeholders to align roadmaps and solve complex process challenges.