Technical Engineering Product/Program Manager– Semiconductor at Red Cell Partners

Torrance, California, United States -

Full Time

Start Date

Immediate

Expiry Date

02 Jan, 26

Salary

215000.0

Posted On

04 Oct, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Product Development, Vendor Management, Customer Engagement, Advanced Packaging, Process Technology, Project Management, Cost Optimization, Technical Communication, Product Management, Application Engineering, Cross-Functional Coordination, HPC, Hyperscaler, Negotiation, Innovation, Testing

Industry

Venture Capital and Private Equity Principals

Description

About Us Red Cell Partners is an incubation firm building and investing in rapidly scalable technology-led companies that are bringing revolutionary advancements to market in three distinct practice areas: healthcare, cyber, and national security. United by a shared sense of duty and deep belief in the power of innovation, Red Cell is developing powerful tools and solutions to address our Nation’s most pressing problems. Technical Engineering Product/Program Manager– Semiconductor About Claros Claros innovates at the intersection of power and compute. We build advanced semiconductor power management solutions that improve AI compute capacity, efficiency and reliability. Claros is an early-stage startup company located in Torrance, CA. If you are looking for challenging work and a strong technical environment with the collaborative & supportive culture, then Claros Tech is the company for you. We offer industry the best competitive pay & benefits and early-stage stock options. Location: Minimum of 3 days a week in the office in Torrance, CA. (Hybrid role) This role will report to: Vice President of Business Development About the Team We are open-minded, fast paced, problem solvers that value open dialogue and candor. Our passion is to challenge the status-quo and we embrace transformational thinking. Our response is never “no, but….” instead “yes, if….”. We are mindful of our personal and organizational blinders and try to build an environment where our team members are At Their Best. About The Role We are seeking a senior technical and program leader to deliver chips, advanced modules, and licensable IP from design handoff through mass production. This role combines semiconductor process and packaging expertise with cross-functional execution, vendor management, and customer engagement. The ideal candidate serves as a Technology Pathfinder, a hybrid role for both customer and internal facing. Customer facing is a blend of product, application, and product management to ensure customer satisfaction and long-term partnership. Internally, bringing advancements in semiconductor, packaging, testing, and manufacturing while guiding engineering decisions together with product architecture. What You Will Do Serve as the primary technical and strategic interface for key HPC and hyperscaler customers, understanding their architecture roadmaps, KPIs, and deployment models. Making sure the internal engineering team is aligned with the customer’s expectations. Drive end-to-end product execution for chips, advanced 2.5D/3D modules, and licensable IP, ensuring on-time, on-spec, and on-cost delivery. Act as the central point of coordination across design, validation, manufacturing, and supply chain to ensure cross-functional alignment and execution against customer milestones. Lead development of reusable IP blocks for internal and external licensing. Guide integration of advanced process nodes (5nm/3nm/2nm) and packaging techniques (chiplets, 3D). Evaluate, qualify, and manage vendors; negotiate pricing and creative financial agreements to optimize cost and risk. Scout and introduce new semiconductors, packaging, and test innovations to maintain a competitive edge. Distill complex technical issues into clear, simple terms and present solution paths with trade-offs. What You Bring BSEE required; MSEE preferred. 8+ years in semiconductor product development with high-volume delivery of chips, modules, and IP. Hybrid Skillset: Demonstrated ability to operate across product engineering, application engineering, and product management disciplines Experience taking devices through qualification, including Automotive standards (AEC-Q100, ISO 26262). Strong knowledge of semiconductor process technology, advanced packaging, and DFM/DFT flows. Familiarity with phase-gate and structured project management processes. Demonstrated ability to reduce overall product cost through strategic supplier negotiations, yield improvements on ATE, and test time optimization. Proven experience managing and qualifying vendors while building strategic partnerships. Ability to simplify complex technical issues and communicate effectively with executives, design leads, and vendors. Track record of delivering and qualifying products to Tier-1 hyperscale/cloud customers. Execution Ownership. Ensures cross-functional alignment and on-time delivery. Technology Pathfinder. Bring in new processes, packaging, and test advancements. Strategic Communication Simplifies complexity and presents trade-offs for decision-making. Cost & Yield Optimization, Reduces total product cost through supplier and test efficiency improvements. Proactivity & Curiosity. Anticipates challenges and seeks innovative solutions. Vendor & Customer Leadership. Builds trust-based partnerships with suppliers and Tier-1 customers. What We Offer Career track opportunity with potential for rapid advancement with strong performance as the firm grows 100% employer paid, comprehensive health care including medical, dental, and vision for you and your family. Paid maternity and paternity for 14 weeks at employees' normal pay. Unlimited PTO, with management approval. Opportunities for professional development and continued learning. Optional 401K, FSA, and equity incentives available. Salary Range: $185,000-$215,000. This represents the typical salary range for this position based on experience, skills, and other factors. We’re an Equal Opportunity Employer: You’ll receive consideration for employment without regard to race, sex, color, religion, sexual orientation, gender identity, national origin, protected veteran status, or on the basis of disability.

Responsibilities

The role involves delivering chips, advanced modules, and licensable IP from design handoff through mass production while ensuring alignment with customer expectations. It requires acting as a central point of coordination across design, validation, manufacturing, and supply chain.