Technical Program Manager - External Manufacturing Operations, Backend Engi at Advanced Micro Devices, Inc

Singapore, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

30 Jun, 26

Salary

0.0

Posted On

01 Apr, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Technical Knowledge, Program Management, Cross-Functional Alignment, Advanced Packaging, Manufacturing Readiness, Process Integration, Product Engineering, Project Management, Interpersonal Communication, Analytical Skills, Data Analytics, Stakeholder Communication, NPI Phase Gates, Quality Assurance, Creative Problem Solving, Time Management

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: Drive & lead programs & projects within External Manufacturing Operations - Backend Engineering (EMO-BE) for advanced packaging technologies (EFB, CoWoS, WLFO) & legacy packaging solutions such as Flip Chip BGA/LGA & chiplet packages. The role focuses on ensuring robust manufacturing readiness, APQP discipline & cross‑functional alignment across both legacy & advanced packaging programs from early NPI phase through ramp. THE PERSON: You will have a balanced mix of strong technical knowledge & program management experience across bumping, packaging & substrate functions, with demonstrated experience in both advanced packaging (EFB, CoWoS, WLFO) & legacy solutions (e.g., Flip Chip BGA/LGA/ chiplet packages). A collaborative team player with a strong sense of ownership and urgency, capable of driving solutions in a fast‑paced, multi‑tasking environment. The role requires excellent cross‑functional project management skills, strong interpersonal effectiveness, & clear, confident communication and presentation abilities. KEY RESPONSIBILITIES: APQP ownership within EMO-BE organization which shall include advanced technologies (EFB, CoWoS, WLFO) & Flip Chip BGA/LGA/chiplet NPI gate reviews on manufacturing readiness, driving cross‑functional alignment from early NPI phase through production ramp, ensuring process, quality, and performance meet program milestones. Formulate, organize, coordinate, and drive interconnected programs or key initiatives with cross functional team members in accordance with the mission and goals of the organization. Drive Key Program deliverables/ schedules/ budget & analyze program risk and opportunities. Effectively communicate across organizations/ levels for program status update (both working details to the team, and executive summary for Executive communication). Collaborate with internal engineering counterparts and extensive engagement with the Package Engineering organization, as well as cross‑functional coordination with teams such as Procurement, Supply Chain, and Reliability. Drive program deliverables and providing accurate, timely program status updates and executive summaries throughout the program lifecycle. Developing innovative programs to support the strategic direction of the organization. Responsibilities may be adjusted or expanded based on business needs, as assigned by the supervisor. PREFERRED EXPERIENCE: Experience in Process Integration or Product Engineering with Program Management experience. Strong hands‑on experience in both Advanced Packaging (EFB, CoWoS, WLFO) and legacy packaging (Flip Chip BGA, LGA & chiplet packages). Proven experience with APQP, NPI phase gates, and manufacturing readiness. Experience in semiconductor engineering environment with NPI to HVM experience. Strong technical communication for executive and cross‑site alignment. Creative, self-driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks. Strong interpersonal communication, analytical, project management, task & time management and excellent communication skills. Experience in managing horizontally across multiple internal functional organizations. Experience with data analytics, dashboards, or data‑driven reporting is a plus. Professional fluency in English to support technical documentation, stakeholder communication, and cross‑site engineering collaboration across the region. ACADEMIC CREDENTIALS: Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Chemical Engineering or related engineering discipline. LOCATION: Singapore #LI-TM3 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Responsibilities

Drive and lead programs within External Manufacturing Operations for advanced and legacy packaging technologies. Ensure robust manufacturing readiness and cross-functional alignment from early NPI phase through production ramp.