Technology development engineer – AIT (Assembly Interconnection Technology) at Bosch Group

Bengaluru, karnataka, India -

Full Time

Start Date

Immediate

Expiry Date

08 Jun, 26

Salary

0.0

Posted On

10 Mar, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Ecu Sealing, Thermal Management, Component Fixation, Electronics Protection, Surface Treatment, Dfmea, Pfmea, Dfma, Statistical Methods, Problem-Solving, Minitab, Teamcenter, Plastics, Die Cast, Sheet Metal, Process Development

Industry

Software Development

Description

Company Description Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 27,000+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is the Technology Powerhouse of Bosch in India with a global footprint and presence in the US, Europe and the Asia Pacific region. Job Description Key responsbilities : Research, develop and implementation of Assembly and Interconnect Technology (AIT) processes for electronic modules such as sealing, thermal management, component fixation, electronics protection (conformal coating, potting, molding) and surface treatment (plasma, laser finishing, wet chemical cleaning etc.) Preparation of process development plan, estimation of effort, time & sample demand and release of contracting Collaborating with the design team by analyzing product design & drawings and providing key insights to ensure the design is optimized for manufacturing and assembly (DFMA) Defining DOEs, plan & conduct trials, analyzing the results and create detailed technical documentation Conducting technical reviews and active contributions in DFMEA, PFMEA & DFMA reviews to identify and mitigate risks early in the development cycles Release of process specification for manufacturing, proving process capability Defining, optimizing, and scaling up processes for series production Coordinate development tasks with internal and external interfaces, including design teams, project management, suppliers, manufacturing plants, and customers to ensure seamless integration and alignment Deviation assessment, risk estimation and provide risk assessment to project Collaborating with international specialized and competence teams Collaborating with production plant for series support Technical expertise (Must-Have) Proven experience in one or more of the following: ECU sealing, thermal management for electronics, component fixation techniques, or electronics protection (conformal coating, potting, over molding). Strong understanding of surface treatment methods (plasma, laser, wet chemical cleaning) Practical experience with quality and risk analysis tools such as DFMEA, PFMEA, and DFMA Good knowledge on Plastics or die cast or sheet metal Good understanding of statistical methods and hands on experience Technical expertise (Desired) Familiarity with automotive industry standards and validation requirements Experience with CAD visualisation software (Team center) & statistical tools (minitab) German language A1 Soft skills: Good Problem-solving & analytical skills and method knowledge Self-driven and initiative, quick learner and passionate to work in the challenging environment. Strong communication and interpersonal skills, with the ability to work effectively in cross-functional teams. Team player with product-centric mindset Qualifications B .Tech/B.E/M Tech Electronics and Communication/Electrical engg Additional Information Location: Bengaluru Qualification: B.E/ B.Tech in Material science (preferred)/Mechanical engineering Experience: 3-5 years of hands-on experience in electronics packaging, assembly processes, or interconnection technology development Legal Entity: Bosch Global Software Technologies Private Limited

Responsibilities

The role involves researching, developing, and implementing Assembly and Interconnect Technology (AIT) processes for electronic modules, including sealing, thermal management, and surface treatments. Key tasks include defining process development plans, collaborating with design teams for manufacturability optimization, and releasing process specifications for series production.