Start Date
Immediate
Expiry Date
28 Jun, 26
Salary
145800.0
Posted On
30 Mar, 26
Experience
0 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Process Development, Device Development, FinFET, 22FDX, Advanced Packaging, 2.5D, 3DHI Technologies, Process Integration, Reliability Demonstration, Process Flows, TCAD Simulation, Modeling, Yield, Cost Objectives, Failure Analysis, Unit Module Process
Industry
Semiconductor Manufacturing
How To Apply:
Incase you would like to apply to this job directly from the source, please click here