Start Date
Immediate
Expiry Date
20 Apr, 26
Salary
0.0
Posted On
20 Jan, 26
Experience
0 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Semiconductor Packaging, Mechanical Engineering, Materials Engineering, AutoCAD, Cadence APD, Finite Element Analysis, Design Of Experiments, Statistical Techniques, Package Failure Analysis, Communication Skills, Interpersonal Skills, Multi-tasking, Deadline Management
Industry
Semiconductor Manufacturing