Thin Film Development Senior Engineer at Seagate Technology LLC - Singapore

Bloomington, Minnesota, United States -

Full Time

Start Date

Immediate

Expiry Date

01 May, 26

Salary

131994.0

Posted On

31 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thin Film Development, Materials Science, Deposition Techniques, Statistical Experimentation, Microstructural Analysis, Chemical Testing, Electrical Testing, Thermal Testing, Mechanical Testing, Clean Room Operations, Process Optimization, Innovation, Documentation, Collaboration, Communication, Multitasking

Industry

Computer Hardware Manufacturing

Description

About our group: Do you want to work on cutting edge technology that pushes the limits of what a whole industry can do? Do you want to help drive the performance of Seagate recording heads beyond that of any other competitor in the world? The HAMR Product Materials Group does just this by delivering new material and deposition process solutions to Seagate’s advanced recording head development effort. As part of the wafer process team, we develop best-in-class films using vacuum- and electrochemistry-based deposition methods, and partner with integration teams to introduce these films into new recording head designs. As an enabler of head performance and reliability advances through materials innovation, we help Seagate win in technology and time-to-market. About the role - you will: Develop novel metal and dielectric thin films and processes for next-generation heat-assisted magnetic recording heads. Create new process modules using a variety of deposition techniques (PVD, IBD, evaporation), and optimize their performance with statistically based experimentation methods. Conduct detailed studies of material properties using microstructural, chemical, electrical and thermal/mechanical test methods. Interface with wafer process and product teams to integrate new process modules into advanced prototype wafer builds. Help assess the impact of new materials and processes on downstream head performance to drive process improvements. Mature baseline vacuum deposition processes to enable transfer into volume manufacturing. Manage the configuration, qualification and time-sharing of R&D deposition equipment systems Work with deposition and metrology capital equipment suppliers to define hardware paths needed for advanced capability and manufacturability. About you: You are self-motivated, able to work independently and have strong attention to detail. You are a team player capable of working in strong partnership with and communicating effectively with a diverse group of engineers and technicians. You are a strong and well-organized multitasker, able to balance day-to-day wafer processing needs with longer-term development work. You can maintain thorough documentation of results and able to clearly discuss and present them with other staff members in engineering and management forums. You have a track record of innovation, with an ability to monitor outside sources (journals, patents, university work and conferences) for developing new ideas and directions. You are able and eager to work in a mix of clean room and laboratory environments. Your experience includes: Bachelor's Degree in Materials Science, Physics, Applied Physics, Electrical Engineering, Chemistry, or similar degree and 5+ years of experience, or Master’s degree in Materials Science, Physics, Applied Physics, Electrical Engineering, Chemistry, or similar degree and 3+ years of experience, or PHD and 0+ years of experience or equivalent education and experience. Strong hands-on experience and in-depth understanding of the materials science, deposition tools and characterization of thin films. Particular consideration will be given to backgrounds in thin film nucleation and growth, microstructural evolution, plasma physics, ion-surface interactions and surface chemistry. Proficiency with statistical experimentation including DOE design and analysis. Prior experience with clean room operations, SPC and factory system (desirable but not required). The estimated base salary range for this position is $92,310.40 - $131,994.72. The individual salary is based on work location and additional factors, including job-related skills, experience, and relevant education or training. Seagate offers comprehensive benefits to its eligible employees, including, but not limited to, eligibility to participate in discretionary bonus program, medical, dental, vision, and life insurance, short-and long-term disability, 401(k), employee stock purchase plan, health savings account, dependent care, and healthcare spending accounts. Seagate also offers paid time off, including 12 holidays, flexible time off provided pursuant to Seagate policy, a minimum of 48 hours of paid sick leave, and 16 weeks of paid parental leave. The benefits for this position are based on a full-time schedule for a full calendar year and may differ depending on work location. Location: Our Normandale campus spans two suburbs, Edina and Bloomington, and serves as the Recording Head development and manufacturing arm of Seagate. Located in the heart of a bustling community, Seagate offers an on-site café, or if you prefer, you can drive to one of many restaurants just minutes away. Need to grab a gift over lunch time? Shopping is abundant in the area. If working out is your thing, the on-site fully equipped fitness center hosts wellness programs, outdoor activities, tournaments and group workouts. Looking for something more laid back? Reset in one of our meditation rooms, or simply take a walk around our indoor walking path. On-site cultural festivals, celebrations and community volunteer opportunities also abound. Location: Normandale, United States Travel: Up to 10%

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Responsibilities

Develop novel metal and dielectric thin films and processes for next-generation heat-assisted magnetic recording heads. Interface with wafer process and product teams to integrate new process modules into advanced prototype wafer builds.