TW_感測器研發_Project Manager – MEMS Packaging Development (ESP2) at Bosch Group

Taipei, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

02 Apr, 26

Salary

0.0

Posted On

02 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Project Management, Semiconductor Packaging, Assembly Processes, Cross-Functional Collaboration, Technical Expertise, Milestone Tracking, Problem Solving, Communication, Adaptability, Teamwork, English Proficiency, Risk Mitigation, Process Engineering, Sample Manufacturing, Customer Communication, International Projects

Industry

Software Development

Description

Company Description Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch. 博世集團於1990 年開始在台灣營運，2006年10月整合台灣地區各事業單位，成立在台事業總部，命名為台灣羅伯特博世股份有限公司。自此即開始為在地客戶提供提升其生活品質的產品與服務。由於我們持續不斷的投資及發展，目前博世在台有三個分公司以及四個研發中心。博世在台提供的產品包含汽車原廠零件、汽車零件售後服務、電動自行車系統、傳動與控制系統、安防通訊系統、熱能產品、電動工具、家電產品以及微機電感測器等。在台灣，博世同時也致力於履行企業社會責任，長期投入在道路安全、環境保護及社會關懷之重點領域。在2013年，台灣博世展開長期的「博世成就愛」社會公益計畫，並舉辦了數場提倡摩托車道路安全的校園宣導活動，同時也與台灣社會大眾分享了博世低碳最佳範例為環保盡一份心力。台灣博世身為全球科技與服務之領導廠商博世集團旗下的一員。博世集團的策略性目標是藉由創新實現互聯生活，在全球透過創新及激發熱情的產品與服務，提升人們的生活品質。簡言之，博世期許能「以科技成就生活之美」。 Job Description • Define & drive milestones: Establish major package‐development milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation. • Design coordination: Coordinate package design and process development for inertial MEMS devices in collaboration with internal engineering teams and external suppliers. • Process engineering: Develop and optimize assembly processes for inertial MEMS in automotive and consumer-electronics applications. • Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners. • Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams. Qualifications • Experience: 3–8 years in semiconductor packaging/assembly (LGA, BGA, DFN, WLCSP, SiP). • Technical expertise: Strong background in semiconductor assembly technologies and materials. Experience in TSV processes and WLSCP device development is a plus. • Project management: Proven ability in milestone tracking, structured reporting, systematic problem solving, multi-task handling, persistence and customer communication. • Global teamwork: Demonstrated success in multicultural, international projects. • Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs. • Language & mobility: Excellent English skills (verbal and written). Precise and target group oriented communication. Willingness to travel as required. Legal Entity: Robert Bosch Taiwan Co., Ltd.

Responsibilities

The Project Manager will define and drive milestones for MEMS packaging development, ensuring timely delivery through planning and risk mitigation. They will coordinate design and process development, oversee sample manufacturing, and collaborate with international stakeholders.