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(中科)蝕刻設備工程師 at Winbond Electronics Corporation

, , -

Full Time

Start Date

Immediate

Expiry Date

18 Jan, 26

Salary

0.0

Posted On

20 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Production Optimization, Machine Evaluation, Capacity Planning, Equipment Maintenance, Performance Improvement, KPI Reporting, Cost Reduction, ISO Maintenance, 6S Maintenance, FDC, EPMS, O.I, EC, SPC

Industry

Semiconductor Manufacturing

Description

【工作內容】作為華邦的(中科)蝕刻設備工程師，你將致力於優化生產機台的品質及性能，排除生產過程中的異常狀況，工作內容包含：1. 機台評估及產能規劃2. 機器設備效能提升規劃3. 蝕刻 TEL-305 /TEL-VIGUS /TEL-SDRM/TEL-VESTA /TEL-LK2 /MATTSON Aspen /MATTSON Suprema /PSK Supra4 /機台設備維護4. 機台MQC改善、POH、AT提昇5. FDC、EPMS、O.I、EC、SPC 維護6. KPI report 撰寫7. Parts Cost down 評估8. ISO / 6S 維護相關事宜【工作地點】中科(台中市大雅區中部科學園區科雅一路8號) 【條件要求】學歷要求：大學科系要求：電機電子工程相關 │ 機械工程相關 │ 光電工程相關相關經驗：不拘語言能力：中文中級管理責任：No輪班需求：Yes出差需求：無外派需求：No

Responsibilities

As a (Central Science Park) Etching Equipment Engineer at Huabang, you will focus on optimizing the quality and performance of production machines and troubleshooting anomalies during the production process. Responsibilities include machine evaluation, capacity planning, and maintenance of various etching equipment.