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(中科)蝕刻製程工程師 at Winbond Electronics Corporation

, , -

Full Time

Start Date

Immediate

Expiry Date

18 Jan, 26

Salary

0.0

Posted On

20 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Etching Process, SPC Maintenance, APC Management, R2R Management, MES Operation, CIM Operation, GUI Interface, Communication, Process Optimization, Power-BI, SQL, Python

Industry

Semiconductor Manufacturing

Description

【工作內容】作為華邦的(中科)蝕刻製程工程師，你將致力於優化生產機台的品質及性能，排除生產過程中的異常狀況，工作內容包含： 1. 蝕刻區 Unit process 線上異常產品處理 (OCAP) 執行與 SPC維護2. 產品製程條件與紀錄確認，及 APC/R2R 等管理系統操作調整3. MES/CIM等自動化系統操作，及各型機台 GUI介面操作使用4. 與 MFG等單位溝通協調相關產能需求5. 蝕刻部門內部計畫維護，及 Unit process製程學習或參數優化評估【工作地點】中科(台中市大雅區中部科學園區科雅一路8號) 【條件要求】學歷要求：碩士科系要求：電機電子工程相關 │ 自然科學學科類(全部) │ 其他工程相關相關經驗：不拘語言能力：英文中級管理責任：No輪班需求：Yes出差需求：無外派需求：No其他條件：對 Power-BI, SQL or Python撰寫或維護熟悉者佳

Responsibilities

As an Etching Process Engineer at Winbond, you will focus on optimizing the quality and performance of production equipment and troubleshooting abnormalities in the production process. Responsibilities include handling online abnormal products, confirming process conditions, operating automated systems, and coordinating capacity needs with relevant departments.