FAMILY DESCRIPTION

Working Student for thermal simulations and verifications of complex high-speed- boards in HW-R&D

SUBFAMILY DESCRIPTION

Come create the technology that helps the world act together
Nokia is committed to innovation and technology leadership across mobile, fixed and cloud networks. Your career here will have a positive impact on people’s life’s and will help us build the capabilities needed for a more productive, sustainable, and inclusive world.
We challenge ourselves to create an inclusive way of working where we are open to new ideas, empowered to take risks and fearless to bring our authentic selves to work.

WHAT YOU WILL LEARN AND CONTRIBUTE TO

We are currently looking for a highly motivated professional who possess a solid technical understanding to support our team to shape the future of optical data transmission.
Our development team focuses on all aspects of architecture, design, implementation, validation, and deployment of printed circuit boards (PCB) for high-speed optical networking applications.

QUALIFICATIONS

• Master student in Mechanical or Computational Engineering (or other relevant fields) with motivation and interest in working with thermal concepts.
• Solid knowledge of Fluid Mechanic, Heat transfer and Thermodynamics
• Experience with thermal simulation softwares (ideally Flotherm)
• Familiarity with thermal testing and measurement equipment (sensors, thermocouples, etc.)
• Experienced with Microsoft Office applications to edit documents, handle test data and create presentations.
• Strength in problem solving.
  Fluent in either German or English, good command of English writing

Please refer the Job description for details