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Director, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics
Shah Alam, Selangor, Malaysia - Full Time
Skills Needed
Semiconductor Packaging, Assembly Engineering, High Volume Manufacturing, Npi To Hvm Transfer, Osat Management, Yield Monitoring, Process Control, Root Cause Analysis, Quality & Reliability Management, Process Change Management, Wide Bandgap Technologies, Statistical Process Control, Design Of Experiments, Team Leadership, Strategic Planning, Cross Functional Collaboration
Specialization
Requires a Bachelor's degree in Engineering or a related field with over 12 years of semiconductor packaging experience and 5+ years of leadership experience. Must possess deep expertise in assembly processes, yield analysis, and managing global outsourced semiconductor assembly and test partners.
Experience Required
Minimum 10 year(s)
Software Engineer (Enablon), G&A Solutions Engineering (GSE) at Apple
Austin, Texas, United States - Full Time
Skills Needed
Enablon, Nabsic, Ehs Program Development, Agile Methodology, Waterfall Methodology, Incident Management, Inspections, Chemical Management, Compliance Management, Risk Management, Action Tracking, Troubleshooting, Software Development, Configuration, Customization
Specialization
Requires at least 2 years of Enablon implementation experience and technical knowledge of the NABSIC coding language. A bachelor's degree in Engineering, Computer Science, Environmental Sciences, or a related field is required.
Experience Required
Minimum 2 year(s)
Electronics Product Design Engineering - Senior Professional at Schneider Electric Industries Malaysia
Bengaluru, karnataka, India - Full Time
Skills Needed
Hardware Requirements Engineering, Pcb Design, Analog Design, Mixed Signal Systems, Digital Design, Signal Integrity, Power Integrity, Emi/Emc Compliance, Worst Case Analysis, Fmea, Embedded Hardware Platforms, Hardware Debugging, V Model, Dfx, Regulatory Compliance, Circuit Simulation
Specialization
Requires 8–12 years of hands-on experience in analog, digital, and mixed-signal hardware development. Must possess deep expertise in PCB stack-up, high-speed routing, EMI/EMC standards, and system-level debugging.
Experience Required
Minimum 10 year(s)
Sr Director, Developer Experience and Platform Engineering at Ford Motor Company
Dearborn, Michigan, United States - Full Time
Skills Needed
Platform Engineering, Developer Experience, Ci/Cd Pipelines, Google Cloud Platform, Container Orchestration, System Architecture, Sre Practices, Polyglot Programming, Api Platforms, Observability, Ai Enabled Engineering, Technical Leadership, Strategic Planning, Software Supply Chain Security, Kpi Development, Distributed Systems
Specialization
Requires over 15 years of software engineering experience with a strong background in building complex distributed systems and production operations. Deep expertise in GCP, container platforms, and polyglot architectures is essential for this leadership role.
Experience Required
Minimum 10 year(s)
Senior Engineer, Process Development & Sustaining Engineering at Western Digital
George Town, Penang, Malaysia - Full Time
Skills Needed
Process Development, Sustaining Engineering, Design Of Experiments (Doe), Statistical Process Control (Spc), Chemical Engineering, Materials Science, Root Cause And Corrective Action (Rcca), Six Sigma, Lean Manufacturing, Failure Analysis, Npi, Technology Transfer
Specialization
Requires a Bachelor's or Master's degree in Chemical Engineering, Materials Science, or a related field. Preferred experience includes 5-10 years in a manufacturing environment with proficiency in SPC, DOE, and Lean Six Sigma.
Experience Required
Minimum 5 year(s)
Director, Integration Architecture & Engineering (Payments) at SMBC
, , Singapore - Full Time
Skills Needed
Integration Architecture, Engineering Leadership, Payments Processing, Api Design, Event Driven Architecture, Oracle Banking Payments, Devops, Stakeholder Management, Governance Frameworks, Data Modeling, System Analysis, Solution Design
Specialization
Requires a Bachelor's degree and 12-18+ years of experience in integration architecture and engineering leadership. Must have deep expertise in payments platforms, specifically Oracle Banking Payments (OBPM/OBPay).
Experience Required
Minimum 10 year(s)
Mechanical Technician, Data Center Engineering and Operations at Amazon Corporate Services Pty Ltd
Eskilstuna, Södermanland County, Sweden - Full Time
Skills Needed
Mechanical Troubleshooting, Preventative Maintenance, Root Cause Analysis, Cooling Systems Maintenance, Contractor Supervision, Risk Assessment, Method Statements, Eam Management, Ticketing Systems, Hvac Troubleshooting, Pump Maintenance, Legionella Testing
Specialization
Requires at least 2 years of experience in mechanical equipment and a valid EU driver's license for site travel. A bachelor's degree in mechanics and specific experience with AHUs, CRAHUs, and HVAC systems are preferred.
Experience Required
Minimum 2 year(s)
Postdoc in Plant-microbiome interactions - DTU Bioengineering at Danmarks Tekniske Universitet
Kongens Lyngby, Capital Region of Denmark, Denmark - Full Time
Skills Needed
Microbiology, Microbial Ecology, Synthetic Communities, R, Python, Genomics, Metagenomics, Plant Microcosms, Greenhouse Trials, Field Trials, Bioinoculants, Biostimulants, Biofungicides, Data Analysis, Project Management, Scientific Communication
Specialization
Candidates must hold a PhD in microbiology, microbial ecology, biotechnology, environmental engineering, or agriculture. Applicants are required to have hands-on experience in areas such as synthetic community design, microbiome data analysis, and field trial coordination.
Experience Required
Minimum 2 year(s)
Staff Engineer, Process Development & Sustaining Engineering at Western Digital
George Town, Penang, Malaysia - Full Time
Skills Needed
Process Development, Design Of Experiments, Statistical Process Control, Chemical Engineering, Materials Science, Root Cause And Corrective Action, Six Sigma, Lean Manufacturing, Failure Analysis, Npi, Technology Transfer, Chemical Qualification, Thin Film, Surface Treatment, Wet Chemical Cleaning, Technical Writing
Specialization
Requires a Master's or PhD in Chemical Engineering, Materials Science, or a related field. Candidates need 2-8 years of experience in a process or manufacturing environment depending on their degree level.
Experience Required
Minimum 5 year(s)
Principal Engineer, Software Development Engineering (Apps) at Sandisk
Milpitas, California, United States - Full Time
Skills Needed
Python, Typescript, Javascript, React, Go, Java, C++, Langgraph, Langchain, Llamaindex, Pytorch, Tensorflow, Kubernetes, Docker, Rag Architectures, Distributed Systems
Specialization
Requires a Master's or PhD in AI, Computer Science, or a related field with over 7 years of software engineering experience. Candidates must have expert-level proficiency in modern AI/ML stacks, distributed systems, and enterprise security.
Experience Required
Minimum 10 year(s)
Software Engineer, Core Services - Apple Services Engineering at Apple
Seattle, Washington, United States - Full Time
Skills Needed
Java, Nosql, Distributed Systems, Scalability, Big Data, Kafka, Spark, Hadoop, Data Structures, Algorithms, Solr, Elastic Search, Redis, Memcached, Cassandra, Voldemort
Specialization
Requires a BS or MS in Computer Science with 4+ years of experience leading complex engineering projects. Must have deep knowledge of Java, NoSQL data stores, messaging technologies like Kafka, and Big Data ecosystems.
Experience Required
Minimum 5 year(s)
[SX/EIT-MM] Software Engineer (Build & Artifact Engineering) at Bosch Group
Ho Chi Minh City, , Vietnam - Full Time
Skills Needed
Cmake, Conan, C++, Python, Gcc/Clang, Git, Embedded Toolchains, Sast, Sca, Solid, Dry, Dependency Management, Build Systems, Static Analysis, Software Design, Agile
Specialization
Requires a Bachelor's degree in IT or Computer Engineering with over 3 years of experience in modern CMake and C++ package managers. Proficiency in Python, embedded compiler toolchains, and Git is essential.
Experience Required
Minimum 2 year(s)
Senior Engineer, Manufacturing Engineering – Process Control at Western Digital
Pasir Gudang, Johor, Malaysia - Full Time
Skills Needed
Electroplating, Process Control, Data Analytics, Machine Learning, Statistical Process Control, Fmea, Doe, 6 Sigma, Python, R, Jmp, Minitab, Power Bi, Tableau, Project Management, Cleanroom Operations
Specialization
Requires a degree in Chemical Engineering or a related engineering field, with a preference for 1-3 years of manufacturing experience. Candidates should be proficient in data analytics tools and have a basic understanding of machine learning concepts.
Experience Required
Minimum 2 year(s)
Director of Fire Engineering (London, Glasgow or Edinburgh) at Egis Group
London, England, United Kingdom - Full Time
Skills Needed
Fire Engineering, Fire Strategy Development, Façade & Cladding Remediation, Building Safety, Project Management, Technical Leadership, Business Development, Smoke Control, Evacuation Modelling, Compliance Planning, Client Relationship Management, Mentoring, Risk Management, Technical Reporting, Multi Disciplinary Coordination, Bim Workflows
Specialization
Requires a degree in a fire-related subject and substantial consultancy experience with deep knowledge of UK fire codes and standards. Candidates should be proficient in fire modelling, technical reporting, and ideally hold Chartered Consultant (CEng) status with the IFE.
Experience Required
Minimum 10 year(s)
Co-op Trainee (Architect Engineering) (Saudi National) (Open) at Parsons Corporation
Riyadh, Riyadh Region, Saudi Arabia - Full Time
Skills Needed
Cad, Architectural Engineering, Engineering Drawings, Technical Manuals, Ansi Standards, Pfi Standards, Asme Standards, Dimensional Calculations, English Speaking, English Writing
Specialization
Candidates must be Saudi Nationals currently enrolled in an accredited Engineering curriculum with at least 3 years of study in Architectural Engineering. Proficiency in English speaking and writing is required, along with a working knowledge of CAD software.
Mechanical Technician, Data Center Engineering and Operations at Amazon Corporate Services Pty Ltd
Eskilstuna, Södermanland County, Sweden - Full Time
Skills Needed
Mechanical Troubleshooting, Preventative Maintenance, Root Cause Analysis, Cooling Systems Maintenance, Hvac, Contractor Supervision, Risk Assessment, Method Statements, Eam Management, Ticketing Systems, Pump Maintenance, Legionella Testing
Specialization
Requires at least 2 years of experience in mechanical equipment and a valid EU driver's license for site travel. A bachelor's degree in Mechanics and specific experience with AHUs, CRAHUs, and industrial water systems are preferred.
Experience Required
Minimum 2 year(s)
Engineering Project Specialist – SoftGoods Apple Watch Bands at Apple
Cupertino, California, United States - Full Time
Skills Needed
Project Management, Bill Of Materials, Engineering Change Orders, Supply Chain Management, Data Management, Hardware Engineering, Ms Excel, Agile, Sap, Configuration Management, Logistics, Vendor Management, Critical Thinking, Communication, Cross Functional Collaboration, Technical Drawing Review
Specialization
Candidates must hold a BA/BS degree or have at least 3 years of relevant industry experience. Proficiency in MS Excel, Agile, and SAP, along with strong organizational and communication skills, is required.
Experience Required
Minimum 2 year(s)
Internship Noise & Vibration Vehicle Performance Engineering at Toyota Motor Europe
Zaventem, Flemish Brabant, Belgium - Full Time
Skills Needed
Digital Audio Workstation (Daw), Acoustics, Nvh Testing, Statistical Analysis, Sound Modeling, Jury Testing, Data Analysis, Auralization, English Fluency
Specialization
Candidates must be pursuing a master's degree in mechanical, acoustical, or electrical engineering and possess basic experience with DAWs. Applicants must hold EEA or Swiss citizenship and be fluent in English.
Engineering Rotational Summer Internship Program - Indonesia at Weatherford Switzerland
, , Indonesia - Full Time
Skills Needed
Analytical Skills, Problem Solving, Teamwork, Communication, Adaptability, Health, Safety, And Environment (Hs&E) Compliance, Engineering Principles, Field Operations, Quality Control, Sales Support
Specialization
Candidates must be currently enrolled in the third or final year of a Bachelor’s or Master’s degree in an engineering-related field. Applicants must possess strong analytical skills, be fluent in English, and have legal authorization to work in Indonesia.
Staff Engineer, Process Development & Sustaining Engineering at Western Digital
George Town, Penang, Malaysia - Full Time
Skills Needed
Process Development, Design Of Experiments (Doe), Statistical Process Control (Spc), Chemical Engineering, Materials Science, Root Cause And Corrective Action (Rcca), Six Sigma, Lean Methodologies, Failure Analysis, Thin Film Technology, Surface Treatment, Wet Chemical Cleaning, Ehs Regulations, Technical Report Writing, Npi Process Readiness, Technology Transfer
Specialization
Requires a Master's or PhD in Chemical Engineering, Materials Science, or a related field. Candidates need 2-8 years of experience in a manufacturing environment depending on their degree level.
Experience Required
Minimum 5 year(s)
Director, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics
Shah Alam, Selangor, Malaysia -
Full Time

Start Date

Immediate

Expiry Date

21 Sep, 26

Salary

0.0

Posted On

23 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Semiconductor Packaging, Assembly Engineering, High-Volume Manufacturing, NPI to HVM Transfer, OSAT Management, Yield Monitoring, Process Control, Root-Cause Analysis, Quality & Reliability Management, Process Change Management, Wide-Bandgap Technologies, Statistical Process Control, Design of Experiments, Team Leadership, Strategic Planning, Cross-functional Collaboration

Industry

Semiconductor Manufacturing

Description
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee yield performance, process stability, quality control, process change management, and manufacturing readiness while partnering closely with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSAT partners to successfully transition New Product Introduction (NPI) programs into scalable high-volume manufacturing (HVM). The ideal candidate combines deep semiconductor packaging assembly expertise with strong operational leadership, data-driven decision-making, and cross-functional collaboration skills to drive manufacturing excellence, product quality, and continuous improvement across global operations. This role also serves as a critical interface to Director, Package Engineering by ensuring package development intent, qualification requirements, process windows, and ramp readiness are translated effectively into stable, cost-competitive, high-volume manufacturing execution. Key Responsibilities Manufacturing & Sustaining Engineering Leadership Lead sustaining engineering across semiconductor package assembly technologies and product lines. Drive high-volume manufacturing performance in yield, cycle time, quality, throughput, and cost. Establish strong engineering systems for process control, defect reduction, and continuous improvement. Align assembly engineering roadmaps with business growth and package technology strategies. Partner with Package Engineering and OSAT teams to ensure manufacturable designs and robust production controls. Yield Monitoring & Continuous Improvement Own assembly yield monitoring, trend analysis, and corrective action processes. Lead data-driven yield improvement initiatives using statistical and problem-solving methodologies. Resolve process, reliability, and customer quality issues through disciplined root-cause analysis. Define KPIs and dashboards to track manufacturing performance and engineering effectiveness. Quality & Reliability Management Partner with Quality and Reliability teams to meet internal, industry, and customer standards. Drive containment, corrective, and preventive actions for manufacturing and field quality issues. Ensure process controls and qualification requirements are maintained across OSAT sites. Support customer, supplier, and internal quality audits and reviews. Work with manufacturing partners to resolve issues early and ensure shipment of qualified products. Process Change Management Lead process change management for materials, equipment, tooling, flows, and sites. Assess engineering changes for technical, quality, reliability, supply, and operational impact. Lead qualification plans for transfers, second sourcing, equipment changes, and cost reductions. Maintain disciplined documentation, change control, and manufacturing readiness processes. NPI to High Volume Manufacturing Ramp Serve as the key manufacturing engineering interface for NPI-to-production transfers. Drive manufacturability reviews and package-process integration during product development. Lead manufacturing readiness, process optimization, and structured ramp execution for new products. Ensure process, qualification, material, site, and capacity readiness for high-volume ramp. Coordinate ramp execution with cross-functional engineering, supply chain, and quality teams. OSAT Partner Management Manage global OSAT and contract manufacturing relationships supporting development and production. Drive partner accountability for yield, quality, cycle time, reliability, and capacity. Lead technical reviews, audits, benchmarking, and qualification assessments for manufacturing partners. Collaborate with suppliers and OSAT partners on transfers, optimization, scaling, and cost improvement. Team Leadership & Organizational Development Build and develop a high-performing global assembly engineering team. Foster a culture of accountability, collaboration, technical excellence, and continuous improvement. Support organizational scaling to meet evolving business and technology needs. Drive talent development, succession planning, and technical capability growth. Strengthen organizational expertise in packaging innovation to support business growth and customer adoption. Qualifications Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline. 12+ years of semiconductor manufacturing and packaging engineering experience with significant exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers. 5+ years of leadership experience managing engineering teams in semiconductor manufacturing environments. Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus. Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools. Experience working with global OSAT partners and outsourced manufacturing ecosystems, including benchmarking, selection, qualification, and ongoing technical management of subcontractors and contract manufacturers. Proven track record of successful NPI-to-HVM product ramp execution. Strong knowledge of semiconductor quality systems, change management, and qualification methodologies. Excellent analytical, organizational, communication, and cross-functional leadership skills. Preferred Qualifications Master’s degree or PhD in Engineering or related field. Experience with advanced packaging technologies such as 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, wafer-level packaging, multi-chip modules, advanced interconnects, and substrate technologies such as DBC and AMB. Familiarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements. Experience managing geographically distributed engineering teams and global manufacturing operations. Knowledge of reliability standards including JEDEC, IPC, and customer qualification requirements. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Employment Type: Regular (PERM) Remote Work Available: No
Responsibilities
Lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies, specifically for AI and data center power applications. Oversee yield performance, quality control, and the transition of New Product Introduction programs into scalable production through OSAT partner management.
Director, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics
Shah Alam, Selangor, Malaysia - Full Time
Skills Needed
Semiconductor Packaging, Assembly Engineering, High Volume Manufacturing, Npi To Hvm Transfer, Osat Management, Yield Monitoring, Process Control, Root Cause Analysis, Quality & Reliability Management, Process Change Management, Wide Bandgap Technologies, Statistical Process Control, Design Of Experiments, Team Leadership, Strategic Planning, Cross Functional Collaboration
Specialization
Requires a Bachelor's degree in Engineering or a related field with over 12 years of semiconductor packaging experience and 5+ years of leadership experience. Must possess deep expertise in assembly processes, yield analysis, and managing global outsourced semiconductor assembly and test partners.
Experience Required
Minimum 10 year(s)
Software Engineer (Enablon), G&A Solutions Engineering (GSE) at Apple
Austin, Texas, United States - Full Time
Skills Needed
Enablon, Nabsic, Ehs Program Development, Agile Methodology, Waterfall Methodology, Incident Management, Inspections, Chemical Management, Compliance Management, Risk Management, Action Tracking, Troubleshooting, Software Development, Configuration, Customization
Specialization
Requires at least 2 years of Enablon implementation experience and technical knowledge of the NABSIC coding language. A bachelor's degree in Engineering, Computer Science, Environmental Sciences, or a related field is required.
Experience Required
Minimum 2 year(s)
Electronics Product Design Engineering - Senior Professional at Schneider Electric Industries Malaysia
Bengaluru, karnataka, India - Full Time
Skills Needed
Hardware Requirements Engineering, Pcb Design, Analog Design, Mixed Signal Systems, Digital Design, Signal Integrity, Power Integrity, Emi/Emc Compliance, Worst Case Analysis, Fmea, Embedded Hardware Platforms, Hardware Debugging, V Model, Dfx, Regulatory Compliance, Circuit Simulation
Specialization
Requires 8–12 years of hands-on experience in analog, digital, and mixed-signal hardware development. Must possess deep expertise in PCB stack-up, high-speed routing, EMI/EMC standards, and system-level debugging.
Experience Required
Minimum 10 year(s)
Sr Director, Developer Experience and Platform Engineering at Ford Motor Company
Dearborn, Michigan, United States - Full Time
Skills Needed
Platform Engineering, Developer Experience, Ci/Cd Pipelines, Google Cloud Platform, Container Orchestration, System Architecture, Sre Practices, Polyglot Programming, Api Platforms, Observability, Ai Enabled Engineering, Technical Leadership, Strategic Planning, Software Supply Chain Security, Kpi Development, Distributed Systems
Specialization
Requires over 15 years of software engineering experience with a strong background in building complex distributed systems and production operations. Deep expertise in GCP, container platforms, and polyglot architectures is essential for this leadership role.
Experience Required
Minimum 10 year(s)
Senior Engineer, Process Development & Sustaining Engineering at Western Digital
George Town, Penang, Malaysia - Full Time
Skills Needed
Process Development, Sustaining Engineering, Design Of Experiments (Doe), Statistical Process Control (Spc), Chemical Engineering, Materials Science, Root Cause And Corrective Action (Rcca), Six Sigma, Lean Manufacturing, Failure Analysis, Npi, Technology Transfer
Specialization
Requires a Bachelor's or Master's degree in Chemical Engineering, Materials Science, or a related field. Preferred experience includes 5-10 years in a manufacturing environment with proficiency in SPC, DOE, and Lean Six Sigma.
Experience Required
Minimum 5 year(s)
Director, Integration Architecture & Engineering (Payments) at SMBC
, , Singapore - Full Time
Skills Needed
Integration Architecture, Engineering Leadership, Payments Processing, Api Design, Event Driven Architecture, Oracle Banking Payments, Devops, Stakeholder Management, Governance Frameworks, Data Modeling, System Analysis, Solution Design
Specialization
Requires a Bachelor's degree and 12-18+ years of experience in integration architecture and engineering leadership. Must have deep expertise in payments platforms, specifically Oracle Banking Payments (OBPM/OBPay).
Experience Required
Minimum 10 year(s)
Mechanical Technician, Data Center Engineering and Operations at Amazon Corporate Services Pty Ltd
Eskilstuna, Södermanland County, Sweden - Full Time
Skills Needed
Mechanical Troubleshooting, Preventative Maintenance, Root Cause Analysis, Cooling Systems Maintenance, Contractor Supervision, Risk Assessment, Method Statements, Eam Management, Ticketing Systems, Hvac Troubleshooting, Pump Maintenance, Legionella Testing
Specialization
Requires at least 2 years of experience in mechanical equipment and a valid EU driver's license for site travel. A bachelor's degree in mechanics and specific experience with AHUs, CRAHUs, and HVAC systems are preferred.
Experience Required
Minimum 2 year(s)
Postdoc in Plant-microbiome interactions - DTU Bioengineering at Danmarks Tekniske Universitet
Kongens Lyngby, Capital Region of Denmark, Denmark - Full Time
Skills Needed
Microbiology, Microbial Ecology, Synthetic Communities, R, Python, Genomics, Metagenomics, Plant Microcosms, Greenhouse Trials, Field Trials, Bioinoculants, Biostimulants, Biofungicides, Data Analysis, Project Management, Scientific Communication
Specialization
Candidates must hold a PhD in microbiology, microbial ecology, biotechnology, environmental engineering, or agriculture. Applicants are required to have hands-on experience in areas such as synthetic community design, microbiome data analysis, and field trial coordination.
Experience Required
Minimum 2 year(s)
Staff Engineer, Process Development & Sustaining Engineering at Western Digital
George Town, Penang, Malaysia - Full Time
Skills Needed
Process Development, Design Of Experiments, Statistical Process Control, Chemical Engineering, Materials Science, Root Cause And Corrective Action, Six Sigma, Lean Manufacturing, Failure Analysis, Npi, Technology Transfer, Chemical Qualification, Thin Film, Surface Treatment, Wet Chemical Cleaning, Technical Writing
Specialization
Requires a Master's or PhD in Chemical Engineering, Materials Science, or a related field. Candidates need 2-8 years of experience in a process or manufacturing environment depending on their degree level.
Experience Required
Minimum 5 year(s)
Principal Engineer, Software Development Engineering (Apps) at Sandisk
Milpitas, California, United States - Full Time
Skills Needed
Python, Typescript, Javascript, React, Go, Java, C++, Langgraph, Langchain, Llamaindex, Pytorch, Tensorflow, Kubernetes, Docker, Rag Architectures, Distributed Systems
Specialization
Requires a Master's or PhD in AI, Computer Science, or a related field with over 7 years of software engineering experience. Candidates must have expert-level proficiency in modern AI/ML stacks, distributed systems, and enterprise security.
Experience Required
Minimum 10 year(s)
Software Engineer, Core Services - Apple Services Engineering at Apple
Seattle, Washington, United States - Full Time
Skills Needed
Java, Nosql, Distributed Systems, Scalability, Big Data, Kafka, Spark, Hadoop, Data Structures, Algorithms, Solr, Elastic Search, Redis, Memcached, Cassandra, Voldemort
Specialization
Requires a BS or MS in Computer Science with 4+ years of experience leading complex engineering projects. Must have deep knowledge of Java, NoSQL data stores, messaging technologies like Kafka, and Big Data ecosystems.
Experience Required
Minimum 5 year(s)
[SX/EIT-MM] Software Engineer (Build & Artifact Engineering) at Bosch Group
Ho Chi Minh City, , Vietnam - Full Time
Skills Needed
Cmake, Conan, C++, Python, Gcc/Clang, Git, Embedded Toolchains, Sast, Sca, Solid, Dry, Dependency Management, Build Systems, Static Analysis, Software Design, Agile
Specialization
Requires a Bachelor's degree in IT or Computer Engineering with over 3 years of experience in modern CMake and C++ package managers. Proficiency in Python, embedded compiler toolchains, and Git is essential.
Experience Required
Minimum 2 year(s)
Senior Engineer, Manufacturing Engineering – Process Control at Western Digital
Pasir Gudang, Johor, Malaysia - Full Time
Skills Needed
Electroplating, Process Control, Data Analytics, Machine Learning, Statistical Process Control, Fmea, Doe, 6 Sigma, Python, R, Jmp, Minitab, Power Bi, Tableau, Project Management, Cleanroom Operations
Specialization
Requires a degree in Chemical Engineering or a related engineering field, with a preference for 1-3 years of manufacturing experience. Candidates should be proficient in data analytics tools and have a basic understanding of machine learning concepts.
Experience Required
Minimum 2 year(s)
Director of Fire Engineering (London, Glasgow or Edinburgh) at Egis Group
London, England, United Kingdom - Full Time
Skills Needed
Fire Engineering, Fire Strategy Development, Façade & Cladding Remediation, Building Safety, Project Management, Technical Leadership, Business Development, Smoke Control, Evacuation Modelling, Compliance Planning, Client Relationship Management, Mentoring, Risk Management, Technical Reporting, Multi Disciplinary Coordination, Bim Workflows
Specialization
Requires a degree in a fire-related subject and substantial consultancy experience with deep knowledge of UK fire codes and standards. Candidates should be proficient in fire modelling, technical reporting, and ideally hold Chartered Consultant (CEng) status with the IFE.
Experience Required
Minimum 10 year(s)
Co-op Trainee (Architect Engineering) (Saudi National) (Open) at Parsons Corporation
Riyadh, Riyadh Region, Saudi Arabia - Full Time
Skills Needed
Cad, Architectural Engineering, Engineering Drawings, Technical Manuals, Ansi Standards, Pfi Standards, Asme Standards, Dimensional Calculations, English Speaking, English Writing
Specialization
Candidates must be Saudi Nationals currently enrolled in an accredited Engineering curriculum with at least 3 years of study in Architectural Engineering. Proficiency in English speaking and writing is required, along with a working knowledge of CAD software.
Mechanical Technician, Data Center Engineering and Operations at Amazon Corporate Services Pty Ltd
Eskilstuna, Södermanland County, Sweden - Full Time
Skills Needed
Mechanical Troubleshooting, Preventative Maintenance, Root Cause Analysis, Cooling Systems Maintenance, Hvac, Contractor Supervision, Risk Assessment, Method Statements, Eam Management, Ticketing Systems, Pump Maintenance, Legionella Testing
Specialization
Requires at least 2 years of experience in mechanical equipment and a valid EU driver's license for site travel. A bachelor's degree in Mechanics and specific experience with AHUs, CRAHUs, and industrial water systems are preferred.
Experience Required
Minimum 2 year(s)
Engineering Project Specialist – SoftGoods Apple Watch Bands at Apple
Cupertino, California, United States - Full Time
Skills Needed
Project Management, Bill Of Materials, Engineering Change Orders, Supply Chain Management, Data Management, Hardware Engineering, Ms Excel, Agile, Sap, Configuration Management, Logistics, Vendor Management, Critical Thinking, Communication, Cross Functional Collaboration, Technical Drawing Review
Specialization
Candidates must hold a BA/BS degree or have at least 3 years of relevant industry experience. Proficiency in MS Excel, Agile, and SAP, along with strong organizational and communication skills, is required.
Experience Required
Minimum 2 year(s)
Internship Noise & Vibration Vehicle Performance Engineering at Toyota Motor Europe
Zaventem, Flemish Brabant, Belgium - Full Time
Skills Needed
Digital Audio Workstation (Daw), Acoustics, Nvh Testing, Statistical Analysis, Sound Modeling, Jury Testing, Data Analysis, Auralization, English Fluency
Specialization
Candidates must be pursuing a master's degree in mechanical, acoustical, or electrical engineering and possess basic experience with DAWs. Applicants must hold EEA or Swiss citizenship and be fluent in English.
Engineering Rotational Summer Internship Program - Indonesia at Weatherford Switzerland
, , Indonesia - Full Time
Skills Needed
Analytical Skills, Problem Solving, Teamwork, Communication, Adaptability, Health, Safety, And Environment (Hs&E) Compliance, Engineering Principles, Field Operations, Quality Control, Sales Support
Specialization
Candidates must be currently enrolled in the third or final year of a Bachelor’s or Master’s degree in an engineering-related field. Applicants must possess strong analytical skills, be fluent in English, and have legal authorization to work in Indonesia.
Staff Engineer, Process Development & Sustaining Engineering at Western Digital
George Town, Penang, Malaysia - Full Time
Skills Needed
Process Development, Design Of Experiments (Doe), Statistical Process Control (Spc), Chemical Engineering, Materials Science, Root Cause And Corrective Action (Rcca), Six Sigma, Lean Methodologies, Failure Analysis, Thin Film Technology, Surface Treatment, Wet Chemical Cleaning, Ehs Regulations, Technical Report Writing, Npi Process Readiness, Technology Transfer
Specialization
Requires a Master's or PhD in Chemical Engineering, Materials Science, or a related field. Candidates need 2-8 years of experience in a manufacturing environment depending on their degree level.
Experience Required
Minimum 5 year(s)