COMPANY OVERVIEW

Sigma Connectivity is a design house. We are a team of 600 talented engineers and our main office is located in Lund, Southern Sweden. Primarily we run in-house projects focusing on connected products within consumer electronics and IoT devices and we have the capability in terms of people, expertise and labs to realize the most demanding products on the market. In US we have offices in San Jose,San Diego and Seattle. The San Diego office is located close to Palomar Airport in Carlsbad ,our office in San Jose is located just by the San Jose airport and our Seattle office is in the heart of Bellevue .As a fast-growing company we are constantly looking for open-minded, talented people who want to take part in our journey. The Sigma Connectivity company culture is about sharing experiences and knowledge and with a Nordic work culture we strive for work-life balance and taking care of people. Within Sigma Connectivity you will never work alone.

JOB OVERVIEW

We are seeking a highly skilled and experienced Principal Embedded Software Engineer to join our team, focusing on the bring-up and optimization of Qualcomm chipsets for cutting-edge devices. In this role, you will be instrumental in the initial bring-up phases, driving Board Support Package (BSP) development, and ensuring robust platform functionality. You will leverage your deep technical expertise to work with the latest Qualcomm technologies, including the Qualcomm 8650 platform and next gen platforms, to deliver high-performance and reliable solutions.

BASIC QUALIFICATIONS

• 5+ years of deep experience in embedded software development, with a significant focus on low-level system programming and hardware-software co-design.
• 5+ years of direct, hands-on experience with Qualcomm chipset bring-up, including debugging and optimizing foundational software.
• Demonstrated expertise in Board Support Package (BSP) development and customization for complex ARM-based systems, preferably with experience in Windows on ARM.
• Strong proficiency in C/C++ programming, assembly, and advanced debugging techniques (e.g., JTAG, Trace32, WinDbg).
• In-depth knowledge of ARM architectures, SoC components, memory subsystems, and common embedded interfaces (PCIe, USB, I2C, SPI, UART, MIPI).
• Proven ability to work independently, taking ownership of ambiguous problems and driving them to resolution.

PREFERRED QUALIFICATIONS

• Direct and recent experience with Qualcomm 8650 (Snapdragon 8 Gen 2/3 series) or other high-performance Qualcomm compute chipsets.
• Experience specifically with Surface products or similar high-volume consumer electronics.
• Familiarity with Windows OS internals, device driver development for Windows, UEFI, and ACPI.
• Experience with power management frameworks, thermal management, and performance tuning for Windows devices.
• Knowledge of security features at the silicon and bootloader level (e.g., secure boot, trusted execution environments).
• Master’s degree /Bacherlor’s. in Electrical Engineering, Computer Engineering, Computer Science, or a related field.

Personal characteristics:

• Team player
• Proactiveness in collaborating and execution.
• Flexibility to switch technical context
• Willingness to learn new methods / tools / processes
• Ability to prioritize and multitask
• Strong problem solving and critical thinking skills
• Strong passion for creativity and solving cutting edge industry problems
• Strong communication and interpersonal skills.

• Lead end-to-end Qualcomm chipset bring-up for consumer products, from silicon power-on to full system functionality, demonstrating a strong self-directed approach to problem-solving and execution.
• Drive and execute targeted BSP changes and optimizations for Qualcomm platforms (e.g., Qualcomm 8650), including bootloaders (UEFI/LK), kernel modifications, device drivers, and system services tailored for Windows on ARM.
• Deep dive into complex, multi-layered debug scenarios, independently isolating and resolving issues across hardware, firmware, and software during the critical bring-up phases.
• Collaborate proactively and autonomously with internal hardware design teams, Qualcomm engineering, and other software teams to ensure seamless integration and performance of new chipsets on targeted devices.
• Optimize system performance, power consumption, and thermal characteristics specifically for the unique demands of laptops and form factors.
• Develop and implement robust diagnostic tools and validation procedures for chipset and BSP verification.
• Provide technical leadership and mentorship to junior engineers, fostering best practices in embedded software development and bring-up.
• Architect and document detailed technical designs, specifications, and troubleshooting guides, ensuring clear communication of complex low-level interactions.