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Jobs Search
Start Date
Immediate
Expiry Date
17 Apr, 26
Salary
0.0
Posted On
17 Jan, 26
Experience
10 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
IC Packaging, System-in-Package, Chiplet Architectures, Flip-Chip BGA, RDL, Silicon Interposers, High-Speed SerDes, DFM, Thermal Design, Mechanical Design, Reliability Design, Cross-Functional Leadership, Cadence Allegro, SI/PI, Packaging Methodologies, Technology Development
Industry
Computer and Network Security
How To Apply:
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