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Jobs Search
Start Date
Immediate
Expiry Date
20 Sep, 26
Salary
0.0
Posted On
22 Jun, 26
Experience
2 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Cadence SIP/Allegro, AutoCAD, CAM, Valor, Substrate Design, Flip Chip, Wire Bonding, 2.5D Design, FCBGA, MCM, Die Fitment Analysis, Thermal Analysis, PKG Warpage, Electrical Performance, Cross-functional Collaboration, Vendor Management
Industry
Semiconductor Manufacturing