Development Engineer for Photonic Integrated Circuitry Testing & Packaging

at  Menlo Systems GmbH

Martinsried, Bayern, Germany -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate15 Nov, 2024Not Specified15 Aug, 2024N/AGood communication skillsNoNo
Add to Wishlist Apply All Jobs
Required Visa Status:
CitizenGC
US CitizenStudent Visa
H1BCPT
OPTH4 Spouse of H1B
GC Green Card
Employment Type:
Full TimePart Time
PermanentIndependent - 1099
Contract – W2C2H Independent
C2H W2Contract – Corp 2 Corp
Contract to Hire – Corp 2 Corp

Description:

Your job in the future market of lasers and photonics
Since its foundation 20 years ago, Menlo Systems GmbH has been one of the world market leaders in the field of optical precision measurements with light and lasers. Based on the Nobel Prize-winning frequency comb technology, we provide our customers worldwide with laser systems that enable applications with the highest precision and accuracy. The systems are mainly used in metrology and spectroscopy, in optical clocks, in quantum technology and quantum computers, as well as in material testing and 3D printing. Our customers include leading research institutions and high-tech companies worldwide.
To strengthen our team at our main site in Planegg-Martinsried near Munich, we are looking for you with immediate effect
Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging

Your tasks

  • Prototype thermal, electrical, and optical packaging solutions for chips
  • Develop the infrastructure and processes for the testing and packaging of optical chips at Menlo Systems
  • Work as part of a team on the realization of PIC-based light sources, such as frequency combs and supercontinua

Your profile

  • Completed university degree in the field of optical engineering, electrical engineering or physics
  • First professional experience as a development engineer for PIC, either in an industrial environment or equivalent experience, e.g., in the framework of a PhD
  • Knowledge and experience in at least two of the following areas: photonic integrated circuitry, packaging, electronics, mechanical design, laser physics, photonics
  • Communication and teamwork skills with a high degree of initiative and persuasiveness
  • Good knowledge of written and spoken German and English

We offer

  • Exciting and challenging tasks in a growing market
  • A highly motivated team, with creative freedom
  • Flexible working hours and 30 days of vacation
  • Individual and practice-oriented training
  • Opportunities for professional development
  • Easily-reached location by public transport and by car
  • A subsidy for public transport, alternatively bicycle leasing or a free parking space

We look forward to receiving your application!
Become part of our team and shape the future with us – we look forward to receiving your online application. To ensure smooth processing, please use the “DIREKT BEWERBEN” button below.
For enquiries about this vacancy, please contact:
Sandra Spasovska
Human Resources
Phone: +49 89 189 166 0
or by e-mail: bewerbung@menlosystems.com
Please note our privacy policy on our website
https:///company/career/datenschutz/
You can find many other vacancies and information about our company here:
https:///company/career/
Interested ?
We are looking forward to receive your letter of application along with vita and certificates.
Menlo Systems GmbH
Bunsenstr. 5
82152 Martinsried

Responsibilities:

  • Prototype thermal, electrical, and optical packaging solutions for chips
  • Develop the infrastructure and processes for the testing and packaging of optical chips at Menlo Systems
  • Work as part of a team on the realization of PIC-based light sources, such as frequency combs and supercontinu


REQUIREMENT SUMMARY

Min:N/AMax:5.0 year(s)

Electrical/Electronic Manufacturing

Engineering Design / R&D

Other

Graduate

Proficient

1

Martinsried, Germany