Silicon photonics / Optical packaging engineer

at  Apple

SUMMARY

Posted: Jul 25, 2024
Role Number:200560653
Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.

DESCRIPTION

Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.

• Excellent teamwork and communication skills
• Strong theoretical background in optics and photonics fundamentals, device/module integration
• B.S plus 10 years works experiences in the related field
• Hands-on experience in packaging and measuring fiber-coupled devices
• Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool

PREFERRED QUALIFICATIONS

• M.S and or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
• Min. 5 years works experiences in the related field with M.S and or Ph.D
• Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …) and experience with silicon photonics device (laser, modulator, PD, passive components such as Si WG, MUX/DeMUX is a plus

Please refer the Job description for details