Analog/mixed-signal IC Design - Acacia

at  Cisco Systems

Application window is expected to close 10/30/24
Acacia designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.

MINIMUM QUALIFICATIONS:

• BSEE degree with 6+ years of experience, or equivalent, an MS degree with 4+ years of experience, Ph.D with 2+ years of experience or equivalent

• Design, simulation and measurement of high speed ICs in at least 3 areas below:

• High Speed Serial Links utilizing serializers, deserializers, and data convertors.
• Voltage Regulators
• High Performance Output Drivers
• High Performance Phase Locked Loops
• Efficient clock Transmission/propagation
• Opamps and Programmable Gain Amplifiers
• Equalization techniques

PREFERRED QUALIFICATIONS:

• Direct experience with electrical transceiver applications including backplane and cable communications
• Experience with FinFET technology

-High-frequency layout experience a plus: Passive component design: inductors, -transformers, transmission-lines, etc.

• Floorplanning (power/ground, digital/analog signal routing, etc.)
• Custom transistor layout

Design for manufacturability:

• Characterization over PVT (monte-carlo analysis)
• Electromigration analysis (using Totem, or equivalent)
• Power and IR drop analysis

Laboratory Validation:

• Solid ESD laboratory practices and methodology
• Construction of test setup to test specific circuitry

Software Experience:

• Experience in the use of high frequency test equipment (BERT, jitter analyzers, VNA/PNA, etc.)
• Cadence (virtuoso)
• Spectre/APS/SpectreX
• Layout validation tools (Virtuoso or Calibre)
• Post-layout Extraction (Virtuoso or Calibre)

• As a member of the Mixed Signal Design team, you will be a key member of a small, dynamic IC Design group that develops high speed (>25Gb/s), and high accuracy, analog designs for optical communications products. You will architect, design, layout, measure and productize ultra-deep sub-micron-based CMOS products.
• You will work on large block for a complex chip and collaborate with our packaging and hardware design team to ensure signal and power integrity specifications are met.