ASIC Package Engineering Intern/Co-Op (Undergrad | Summer, 2025 | Onsite/hybrid)

at  AMD

Job Description

WHO WE ARE LOOKING FOR:

You are currently enrolled in a Canada based University into a Bachelor’s degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
If you have knowledge / experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply -
Course related to transmission lines and electric circuits
Package, silicon or PCB design software
Scripting languages - Perl / Python / SQL
Semiconductor theory and packaging process/technology
Data analytics and data visualization tools like PowerBI
Note: By submitting your application, you are indicating your interest in AMD intern positions. We are recruiting for multiple positions, and if your experience aligns with any of our intern opportunities, a recruiter will contact you.
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
An exciting internship opportunity to make an immediate contribution to AMD’s next generation of technology innovations awaits you! We have a multifaceted, high-energy work environment filled with a diverse group of employees, and we provide outstanding opportunities for developing your career. During your internship, our programs provide the opportunity to collaborate with AMD leaders, receive one-on-one mentorship, attend amazing networking events, and much more. Being part of AMD means receiving hands-on experience that will give you a competitive edge. Together We Advance your career!

WHAT YOU WILL BE DOING:

We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality. In this role -
We will have your involvement in supporting Package design and Package Development Engineers in prioritizing and optimizing new projects
We will train you to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates
We will assign you projects related to design verification implementation to ensure design performance, quality and efficiency
Analyzing yield and defect metrics to ensure design performance and help improve the yield will be part of your responsibilities
We will encourage you to evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements