IC Signoff Lead
at MEDIATEK SINGAPORE PTE LTD
Singapore, Southeast, Singapore -
| Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
|---|---|---|---|---|---|---|---|
| Immediate | 14 Nov, 2024 | USD 8000 Monthly | 16 Aug, 2024 | N/A | Good communication skills | No | No |
Required Visa Status:
| Citizen | GC |
| US Citizen | Student Visa |
| H1B | CPT |
| OPT | H4 Spouse of H1B |
| GC Green Card |
Employment Type:
| Full Time | Part Time |
| Permanent | Independent - 1099 |
| Contract – W2 | C2H Independent |
| C2H W2 | Contract – Corp 2 Corp |
| Contract to Hire – Corp 2 Corp |
Description:
MediaTek’s Physical design team is responsible to implement top quality digital backend design for our advanced process chips which have billions of transistors.
Responsibilities:
- IC physical design signoff of 6nm/4nm/3nm and below world leading advanced process chip
- Lead team to do Timing/IR/EM signoff & fixing of block and SoC level design
- Coordination on the signoff and fixing tasks together with frontend team and physical design team for the complicated hierarchical chip (more than 20 million instances plus 1000+ macros)
- Signoff flow development to enhance project execution efficiency
REQUIREMENT SUMMARY
Min:N/AMax:5.0 year(s)
Information Technology/IT
IT Software - Application Programming / Maintenance
Software Engineering
Graduate
Proficient
1
Singapore, Singapore
