Microelectronics Cryogenic Test Focal (Lead or Senior)

at  Boeing

Tukwila, Washington, USA -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate05 Dec, 2024USD 210450 Annual07 Sep, 20244 year(s) or aboveLibrary Development,Maintenance,Test Procedures,Circuit Design,Extreme Environments,Architecture,Soi,Mathematics,Network Analyzer,Physics,Radiation,Spectrum Analyzer,Oscilloscope,Technical Leadership,Test Equipment,Computer Science,CharacterizationNoNo
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Description:

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
Our teams are currently hiring a Microelectronics Cryogenic Test Focal (Lead or Senior) to join our team in Tukwila, WA.
We are Boeing Research & Technology (BR&T): Boeing’s global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld
Within BR&T, Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification), packaging, and test in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers, and is nationally recognized in aerospace microelectronics design communities. SSED’s large staff of microelectronics engineers conduct research, design, and test microelectronics hardware in support of these projects.
SSED executes a variety of exciting, technically challenging projects, offering endless opportunities to develop depth and breadth of technical skills. We offer on-the-job learning opportunities and long-term potential for career growth into both technical leadership and/or management positions and seek curiosity, creativity, innovation, attention to detail, clear communication, and the ability to understand and meet customer needs.
We are seeking an experienced engineer to lead microelectronics cryogenic test activities, develop innovative strategies to improve and grow test capability of our group, and to coordinate with labs at other sites. SSED tests custom-designed microelectronics, ranging from characterization test chips to SoCs to integrated chip sets, to include bring up and debug, electrical testing, performance characterization, reliability stresses, radiation testing, and characterization across extreme environments. SSED is expanding our cryogenic test capabilities, including facilities, capital equipment, and test processes, across multiple sites.

BASIC QUALIFICATIONS (REQUIRED SKILLS/EXPERIENCE):

  • Bachelor, Master or Doctorate degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
  • 5+ years of experience with test of integrated circuits
  • Hands-on experience utilizing high-performance microelectronics test equipment (prober, power supply, oscilloscope, spectrum analyzer, network analyzer, etc.)
  • Experience developing and implementing automated test strategies
  • Excellent verbal and written skills with ability to communicate task progress and challenges within team and with technical leadership

PREFERRED QUALIFICATIONS (DESIRED SKILLS/EXPERIENCE):

  • 10+ years of related work experience or an equivalent combination of education and experience
  • Experience with characterization and test of microelectronics for extreme environments (cryogenic and high temp, radiation, etc.)
  • Experience organizing and leading teams to safely and successfully execute test campaigns
  • Hands-on experience with cryogenics equipment (dry cryostats, wet cryostats, compressors, chillers, turbo pumps, residual gas analyzers, dewars, measurement gauges, etc.), to include operation and maintenance
  • Experience with design-for-test strategies and circuit design
  • Demonstrated track record as a self-motived, independent, high-performance team member
  • Experience defining test documentation, to include standard operating procedures, test plans, and test procedures
  • Understanding of IC development flow and tools to include device-level modelling and library development; IC-level requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test.
  • Understanding of semiconductor device physics
  • Understanding of commercial semiconductor fabrication process technologies, to include standard CMOS, SOI, SiGe, and GaN.
  • Experience supporting military programs to include engagement with customers
  • Active security clearance

Responsibilities:

  • Allocate test personnel and lab resources to meet program needs
  • Develop and enforce test procedures and processes to meet evolving program needs
  • Manage priorities with stakeholders
  • Develop plans for lab expansion and capability upgrades


REQUIREMENT SUMMARY

Min:4.0Max:12.0 year(s)

Electrical/Electronic Manufacturing

IT Software - QA & Testing

Other

Graduate

Engineering computer science mathematics physics or chemistry

Proficient

1

Tukwila, WA, USA