MTS Packaging Engineer

at  Advanced Micro Devices Inc

PREFERRED EXPERIENCE:

• Skillful in SI characterization including VNA and TDR
• Experience in [S] processing and Impedance analysis
• >3 years hands-on experiences

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
Responsibilities:

THE ROLE:

The Power / Signal Integrity engineering team ensures the performance of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization

KEY RESPONSIBILITIES:

• Experience in silicon, packaging, connector and board design for power & signal integrity
• Experience in measurement tools VNA, TDR and high speed oscilloscope
• Experience in test board design, measurement fixtures and de-embedding methodologies
• Experience in analog characterization and processing of s-parameters
• Knowledge in high-speed digital signaling interfaces such as PCIE, USB, GDDR and DDR is a plus
• Knowledge in electrical modeling EDA tools such as HFSS, SIwave, ADS, etc. is a plus
• Knowledge in electromagnetic theory and digital circuit analysis is a plus
• Skills in developing and mentoring team members is another plus
• Ability to collaborate and work across different functional teams and different sites
• Self-driven and can work independently