Packaging Engineer

at  Texas Instruments

WE CAN’T PREDICT WHAT THE FUTURE HOLDS, BUT WE KNOW TEXAS INSTRUMENTS WILL HAVE A PART IN SHAPING IT.

As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.

MINIMUM REQUIREMENTS:

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering or Materials Engineering
• Minimum 10 years of relevant experience

PREFERRED QUALIFICATIONS:

• Experience with:
• packaging/assembly of power semiconductors
• multi-PCB module assembly process
• vertical integration of disparate components
• reliability & manufacturability of electronic sub-systems/modules
• directing materials & process flows in AT sites
• mechanical & thermal modeling of power modules
• Ability to establish strong relationships with key stakeholders critical to success, such as
• sub-contractor and internal assembly sites
• global design and manufacturing teams
• component suppliers
• Strong verbal and written communication skills
• Working knowledge of engineering CAD tools

Partnering with TI’s internal Power businesses to design and develop innovative power module packaging technologies, focused on miniaturization and integration:

• Define and validate design rule roadmaps for multi-PCB power modules/sub-systems with vertical integration
• Review and approve power module designs
• Define and validate materials and process flows for these sub-systems
• Define learning cycles and establish a robust assembly flow for new power modules
• Guide the factory engineering team during qualification and production ramp of these sub-systems
• Review assembly line quality and compliance
• Lead discussions with customers on manufacturing and reliability aspects of power modules