Principal Engineer, Signal Integrity

at  Micron

OUR VISION IS TO TRANSFORM HOW THE WORLD USES INFORMATION TO ENRICH LIFE FOR ALL.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR61234 Principal Engineer, Signal Integrity

Micron Technology’s vision is to transform how the world uses information to enrich life for all and our dedication to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and patience while supporting our global community.

• The Signal Integrity Research and Development (SI R&D) team supports all of Micron’s current and future product developments.
• Major product technologies developed at Micron include DRAM, LPDRAM, Graphics DRAM, NAND, HBM, HMC, 3DXP, Managed NAND and SSDs within the consumer, server, mobile, networking, graphics, automobile, and embedded businesses.
• The SI R&D works on analysis of end-to-end systems solutions including but not limited to circuit level, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron’s memory solutions. The focus of this job is integrated circuit package design.
• The team owns all steps of the signal and power integrity analysis process including die, package and system model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support.
• The team also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS. The group working environment is technically challenging, team-oriented, collaborative, and customer-centric.

Within the larger SI R&D group, as a Principal Signal Integrity Engineer at Micron, you will be responsible for:

• Leading the design and analysis of high speed (HS) memory interfaces and power distribution networks (PDN).
• Leading out in SI/PI development across a broad range of Micron’s portfolio to ensure product electrical performance through modeling, simulation, analysis, and correlation to measurement for the various products.
• Representing the SI R&D team in technical cross-functional collaborative groups, and integrating with package design, silicon design, system design, product engineering, and marketing departments to ensure overall product performance.
• Driving and development of SI/PI aspects of future standards (including but not limited to JEDEC, ONFI, and IBIS) through system and product electrical capability exploration.
• Supporting external customer as needed
• Developing methodologies and processes for SI/PI analysis
• Supporting and driving path-finding activities for IO and channel innovation to enable next generation of memory technologies at higher speeds and densities
• Providing technical leadership and coaching junior engineers in SI/PI topics.

QUALIFICATIONS

• PhD or MSEE and with at least 10 years of industry experience
• Strong SI/PI/EMI theory and application, modeling, analysis, simulation.
• Deep experience in Signal and Power Integrity Background, particularly in areas that affect I/O circuit signaling performance, PMICs, current workloads, PI performance & optimization and experience with equalization schemes for IO circuits
• Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience
• Experience with, and working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc.
• Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single-ended interface technologies
• Deep understanding of timing budgets and jitter analysis
• Expertise in Printed Circuit Board (PCB) layout or electrical package design techniques
• Experience in design and analysis of high-speed single-ended or differential buses
• Familiarity with, and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
• Familiarity with peak distortion analysis, statistical analysis (DOE) and equivalent tools (example: JMP) is also beneficial
• Memory industry experience is desired
• Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths
• Understanding of AI/ML is desired
• You will be required to move to USA after one year of working from Singapore office.

Micron Technology’s vision is to transform how the world uses information to enrich life for all and our dedication to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and patience while supporting our global community.

• The Signal Integrity Research and Development (SI R&D) team supports all of Micron’s current and future product developments.
• Major product technologies developed at Micron include DRAM, LPDRAM, Graphics DRAM, NAND, HBM, HMC, 3DXP, Managed NAND and SSDs within the consumer, server, mobile, networking, graphics, automobile, and embedded businesses.
• The SI R&D works on analysis of end-to-end systems solutions including but not limited to circuit level, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron’s memory solutions. The focus of this job is integrated circuit package design.
• The team owns all steps of the signal and power integrity analysis process including die, package and system model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support.
• The team also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS. The group working environment is technically challenging, team-oriented, collaborative, and customer-centric

Within the larger SI R&D group, as a Principal Signal Integrity Engineer at Micron, you will be responsible for:

• Leading the design and analysis of high speed (HS) memory interfaces and power distribution networks (PDN).
• Leading out in SI/PI development across a broad range of Micron’s portfolio to ensure product electrical performance through modeling, simulation, analysis, and correlation to measurement for the various products.
• Representing the SI R&D team in technical cross-functional collaborative groups, and integrating with package design, silicon design, system design, product engineering, and marketing departments to ensure overall product performance.
• Driving and development of SI/PI aspects of future standards (including but not limited to JEDEC, ONFI, and IBIS) through system and product electrical capability exploration.
• Supporting external customer as needed
• Developing methodologies and processes for SI/PI analysis
• Supporting and driving path-finding activities for IO and channel innovation to enable next generation of memory technologies at higher speeds and densities
• Providing technical leadership and coaching junior engineers in SI/PI topics