Principal Engineer, Sinter Process Development (R&D)

at  onsemi

• Responsible for introducing new products from characterization, validation, large scale, qualification, and safe launch for mass production releases in pressure / p-less sintering processes using film and paste materials.
• Performs package design review, and risk analysis and conducts studies on materials suitable for the package & process
• Review engineering builds requirements and engineering instructions for new products
• Responsible for reviewing, generating, updating, and approving specifications
• Achieves operational objectives by contributing information and recommendations on new product releases
• Preparing and completing assembly build qualification reports, production release documents per device and systems configurations, safe launch reports for initial production released parts
  onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
  More details about our company benefits can be found here:
  https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

• Education:
• Masters/Degree of Materials, Chemical, Mechanical, Electronics, Electrical Engineering and/or BS Physics.
• Experience
• More than fifteen (15) years experience in New Package Development for semiconductor applications in leadframe substrates(QFN, MQFP, TQFP, SOIC, TSSOP, PDIP, and others) with sintering processes expertise.
• Experience in GaN (dicing/assembly/ DA/flip chip) processing is an advantage
• Skills:
• Strong skills in DOE (Design of Experiments), 7QC Tools, SPC, Data Analysis, Control Plan, FMEA, 8D, RCCA, Problem Solving, Decision Analysis, Rheology, material science and process engineering
• Strong English communication skills
• Working knowledge on large scale, safe launch and pre-production releases (APQP)
• Good interpersonal skills in collaborating with support groups
• Highly motivated to work in a dynamic environment, with good integrity and character
• Ability to multi-task and organize work systematically in meeting deadlines without compromising quality

Please refer the Job description for details