Process Engineer 4
at Lam Research
Tualatin, OR 97062, USA -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 20 Nov, 2024 | Not Specified | 22 Aug, 2024 | 3 year(s) or above | Process Control,Design,Ale,Python,Icp,Plasma Physics,Physics,Statistical Tools,Matlab,Minitab,Reactive Ion Etching,Semiconductor,Analytical Techniques,Ccp,Chemistry,Jmp,Atomic Layer Deposition,Inductively Coupled Plasma,Surface Preparation | No | No |
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Description:
THE IMPACT YOU’LL MAKE
As a Process Engineer at Lam, you will operate on cutting-edge technology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Your role involves developing new and advanced process formulations, defining equipment hardware to meet processing requirements, evaluating test data, and coordinating design requirements to ensure compatibility of processing methods. Your expertise and knowledge play a crucial role our customers success, making an impact on the next generation of semiconductor breakthroughs.
In this role, you will directly contribute to The Deposition Group.
MINIMUM QUALIFICATIONS:
- Master’s degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field with 6+ years of experience; or a PhD with 3+ years’ experience; or equivalent experience.
PREFERRED QUALIFICATIONS
- Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques.
- In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
- Highly proficient in MATLAB, Python, or other similar scientific computing language.
- Working knowledge of statistical analysis and problem-solving methodologies.
- Experience with statistical tools (JMP, Minitab, etc.)
- Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD).
- Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP).
- Knowledge of Material synthesis and material characterization.
- Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners.
- Experience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc.
Responsibilities:
- Conduct process engineering research, development, and evaluation in support of Lam’s cutting-edge semiconductor equipment and systems.
- Review and enhance processing techniques and methods applied in the manufacture and fabrication of products.
- Develop and sustain new processes and process improvements to reduce production costs and increase yields.
- Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications.
- Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications.
- Partner cross-functionally and with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges.
- Contribute to next generation product development and release activities supporting the semiconductor roadmap.
- Provide leadership, clear direction, and guidance to process technicians to support execution activities.
REQUIREMENT SUMMARY
Min:3.0Max:6.0 year(s)
Information Technology/IT
Engineering Design / R&D
Software Engineering
Graduate
Chemical, Chemistry, Engineering
Proficient
1
Tualatin, OR 97062, USA