R&D Mechanical Design Engineer/Senior

at  MIT SEMICONDUCTOR PTE LTD

EDUCATION AND EXPERIENCE

• BE/BS Mechanical Engineering.
• 0-3 years experience in designing and developing automated equipment.
• 3D solid modeling, preferably Creo (others like Solidworks, NX are also acceptable).
• Electro-mechanical module conceptualization and design.
• Pneumatic/fluid circuit design.
• Detail fabrication drawings, assembly drawings and layout drawings.
• Selection and sizing of standard components available off the shelf.

Preferred experience

• Ultra high-precision machine design.
• High-speed pick and place mechanism design.
• Structural, kinematics and dynamic analyses and FEA simulations.
• Geometrical tolerancing and dimensional analyses.
• Engineering material selection.
• Manufacturing process selection.
• Application of analysis tools like FMEA, DOE.

Design and develop high-precision semiconductor equipment to meet the processing and automation needs of customers. To succeed in this position, you need to:

• Understand the design specification given to you by the design lead.
• Understand the company’s design standards and best practices.
• Understand the constraints within which your design must work.
• Understand geometric tolerances and dimensional analyses.
• Choose components based on an understanding of function, reliability, and costs.
• Choose materials based on an understanding of materials science and engineering.
• Understand design for manufacturability/assembly.
• Work with the Electrical Engineer to choose drives and electrical components (if any).
• Discuss with the Software Engineer on any interlocking logic requirements.
• Lay the design concept down in the 3D CAD.
• Perform DFMEA during the design process.
• Submit the CAD module to the system integrator to check for interface issues.
• Review the design with the design lead.
• Put the part designs down on drawings, carefully specifying tolerances and specifications.
• Build the module BOM.
• Procure the module components.
• Review the assembly of the physical module.
• Perform design improvements where appropriate.