Research Process Fabrication Engineer
at KBR
WPA, OH 45433, USA -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 27 Dec, 2024 | Not Specified | 29 Sep, 2024 | 6 year(s) or above | Excel,Design,Scanning,Communication Skills,Complex Systems,Ellipsometry | No | No |
Required Visa Status:
Citizen | GC |
US Citizen | Student Visa |
H1B | CPT |
OPT | H4 Spouse of H1B |
GC Green Card |
Employment Type:
Full Time | Part Time |
Permanent | Independent - 1099 |
Contract – W2 | C2H Independent |
C2H W2 | Contract – Corp 2 Corp |
Contract to Hire – Corp 2 Corp |
Description:
PROGRAM SUMMARY
At KBR, We Deliver by transforming science into new possibilities for our customers. Be part of a multi-disciplinary team of engineers and researchers to discover and develop new and relevant military-critical electronics to maintain our nation’s air, space, and cyber superiority. KBR supports the Air Force Lifecycle Management Center and Air Force Research Laboratory.
JOB SUMMARY
KBR is seeking a highly motivated Research Process Fabrication Engineer. The candidate will work on the AFRL 3D Heterogeneous Integration (HI) team to develop fabrication techniques, fabricate, and characterize devices that provide viable solutions to HI technology. One focus will be on cleanroom wafer scale processing with necessary processing capabilities including (but not limited) to photolithography, lift-off, reactive and deep reactive ion etching (RIE, DRIE), metallization (evaporation, sputtering, and/or e-beam), and electroplating. In addition, have the ability to learn and utilize flip-chip bonding techniques. Research will also consist of optimizing existing processing techniques as well as process improvements through new materials and procedures with the overall goal being to increase performance and yield of devices made through the HI process.
BASIC QUALIFICATIONS
- Education: High school diploma with 6 years’ experience
- Experience with cleanroom processing
- Experience with in-depth analysis techniques such as Scanning Electron Microscope, Atomic Force Microscope, ellipsometry, Focus Ion Beam, and Hall measurements
- Experience on projects in micro- and nano-scale electrical device fabrication area
- Competency in design of experiments (DOE) methodology
- Must be a US citizen and meet Air Force Research Laboratory requirements to access Wright-Patterson Air Force Base.
PREFERRED QUALIFICATIONS
- Proficiency in troubleshooting issues in complex systems.
- Effective organizational, interpersonal, and communication skills.
- Independently manage and prioritize multiple different projects.
- Proficiency with Word, Excel, Power Point, and KLayout.
- Ability to work and be part of a multidisciplinary team.
Responsibilities:
- Develop, implement, improve, analyze, characterize, and test fabrication procedures of semiconductor materials and devices for HI technologies.
- Conduct analyses addressing issues such as failure, reliability, or yield improvement.
- Perform root cause analysis, prepare reports and provide updates/presentations to team and project leads.
- Develop and maintain customer documentation such as training manuals, operating instructions, and process fabrication followers.
- Able to perform safely in a microfabrication cleanroom and follow standard safety and operating practices.
REQUIREMENT SUMMARY
Min:6.0Max:11.0 year(s)
Information Technology/IT
IT Software - Other
Software Engineering
Diploma
Proficient
1
Wright-Patterson AFB, OH 45433, USA